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Epoxies, Ect. 20-2121

Generic Family: Polyurethane, UnspecifiedSupplied by: Epoxies, Etc.
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling.

The 20-2121 Polyurethane meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. The raw materials used in this product comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.

The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.

Features:
- Low Toxicity
- Green
- Low Viscosity
- Low Durometer
- Moisture Resistant
- Low Shrinkage & Exotherm
- FDA compliant

Benefits:
- Reduce employee exposure to dangerous chemicals
- Reduce demand on non-renewable fossil fuels
- Quick self leveling around components
- Low stress on components & vibration resistant
- Can be used in wet environments
- Will not damage components during cure
- May be used in food contact applications
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical Parts
Processing Method
Casting
Other Properties
Features, Agency Ratings, Appearance, Mold Shrink, Linear-Flow, CLTE, Flow, Thermal Conductivity, Surface Resistivity, Thermoset Mix Viscosity, Additional Properties, Color, Mix Ratio by Weight (PBW), Mix Ratio by Volume (PBV), Density, Viscosity, Curing Time, Gel Time, Shore Hardness, Tensile Strength, Tensile Elongation at Break, Tear Strength, Electric Strength, Volume Resistivity, Dielectric Constant, Dissipation Factor
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Processing

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Where To Buy

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