The 10-2055 and 10-2055 HV were developed to produce general purpose, semi flexible polyurethane adhesives for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. The same Iso component is used separately with each Polyol at a convenient 1:1 ratio by volume. The selection of Polyol determines the initial viscosity of the adhesive. 10-2055 produces a light paste consistency similar to honey and 10-2055 HV produces a heavy paste consistency similar to grease. Please note each Iso and Polyol offer good low viscosity handling characteristics and turn thixotropic upon mixing.

The 10-2055 and 10-2055 HV were developed to produce general purpose, semi flexible polyurethane adhesives for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. The same Iso component is used separately with each Polyol at a convenient 1:1 ratio by volume. The selection of Polyol determines the initial viscosity of the adhesive. 10-2055 produces a light paste consistency similar to honey and 10-2055 HV produces a heavy paste consistency similar to grease. Please note each Iso and Polyol offer good low viscosity handling characteristics and turn thixotropic upon mixing.

The 10-2080 and 10-2080 HV were developed to produce general purpose, semi rigid polyurethane adhesives for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. The same isocyanate (iso) component is used separately with each polyol at a convenient 1:1 ratio by volume. The selection of polyol determines the initial viscosity of the adhesive. 10-2080 produces a light paste consistency similar to honey and 10-2080 HV produces a heavy paste consistency similar to grease. Please note each iso and polyol offer good low viscosity handling characteristics and turn thixotropic upon mixing.

The 10-2080 and 10-2080 HV were developed to produce general purpose, semi rigid polyurethane adhesives for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates with different CTE's. The same isocyanate (iso) component is used separately with each polyol at a convenient 1:1 ratio by volume. The selection of polyol determines the initial viscosity of the adhesive. 10-2080 produces a light paste consistency similar to honey and 10-2080 HV produces a heavy paste consistency similar to grease. Please note each iso and polyol offer good low viscosity handling characteristics and turn thixotropic upon mixing.

20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. The density is 11 pounds per cubic foot. 20-2028 is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). It is also safer to use since it does not utilize MOCA or TDI. 20-2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. Castings can be hand poured or machine dispensed. Features: - Excellent chemical solvent and moisture resistance - Outstanding thermal shock resistance - Good impact resistance - Very good electrical insulation value - Very fast curing

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80. Green: - The base Natural Oil Polyol (NOP) used in these systems is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP's, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - Green - Low Viscosity - Available in TriggerBond® - Low Durometer - Moisture Resistant - Convenient Mix Ratios - Low Shrinkage & Exotherm Benefits - Reduce demand on non-renewable fossil fuels - Quick self leveling around components - Easy to use packaging - Low stress on components & vibration resistant - Can be used in wet environments - Easy to process by hand or with meter mix - Less stress to components during cure

20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling. The 20-2121 Polyurethane meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. The raw materials used in this product comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - Low Toxicity - Green - Low Viscosity - Low Durometer - Moisture Resistant - Low Shrinkage & Exotherm - FDA compliant Benefits: - Reduce employee exposure to dangerous chemicals - Reduce demand on non-renewable fossil fuels - Quick self leveling around components - Low stress on components & vibration resistant - Can be used in wet environments - Will not damage components during cure - May be used in food contact applications

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80. Green: - The base Natural Oil Polyol (NOP) used in these systems is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP's, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - Green - Low Viscosity - Available in TriggerBond® - Low Durometer - Moisture Resistant - Convenient Mix Ratios - Low Shrinkage & Exotherm Benefits - Reduce demand on non-renewable fossil fuels - Quick self leveling around components - Easy to use packaging - Low stress on components & vibration resistant - Can be used in wet environments - Easy to process by hand or with meter mix - Less stress to components during cure

20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of substrates. Features: - Outstanding environmental performance - Controlled flow - Easy mixing - High impact resistance - Available in Triggerbond® cartridges

20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies, watertight electrical connectors, cables, printed circuitry, and other electrical components. It provides a quick gel to prevent too much flow. Features: - Outstanding environmental performance - Controlled flow - Easy Mixing - Available in Triggerbond® Cartridges

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80. Green: - The base Natural Oil Polyol (NOP) used in these systems is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP's, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - Green - Low Viscosity - Available in TriggerBond® - Low Durometer - Moisture Resistant - Convenient Mix Ratios - Low Shrinkage & Exotherm Benefits - Reduce demand on non-renewable fossil fuels - Quick self leveling around components - Easy to use packaging - Low stress on components & vibration resistant - Can be used in wet environments - Easy to process by hand or with meter mix - Less stress to components during cure

This polyurethane is engineered for electronic potting, encapsulating, and casting applications. It is low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. This elastomeric system is suitable for a variety of electronic insulating applications. A key feature of this product is the quick demolding time of 1 Hour for encapsulating or casting. 20-2183 is a faster gelling version of 20-2180. Green: The base Natural Oil Polyol (NOP) used in this system is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: - 1 Hour Demolding - Green - Low Viscosity - Available in TriggerBond - Low Durometer - Moisture Resistant - Low Shrinkage & Exotherm Benefits - Need fewer molds for production - Reduce demand on non-renewable fossil fuels - Quick self leveling around components - Easy to use packaging - Low stress on components & vibration resistant - Can be used in wet environments - Less stress to components during cure

This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. These unique urethane formulations maintain their integrity over a wide operating temperature range. The low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. These systems exhibit very little hardness increase when cooled to -72°C. Features: - Maintains flexibility at low temperatures - Thermal cycling stability - Excellent electrical insulation - Chemical resistance - Low stress on sensitive components - Hydrolytic stability

This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. These unique urethane formulations maintain their integrity over a wide operating temperature range. The low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. These systems exhibit very little hardness increase when cooled to -72°C. Features: - Maintains flexibility at low temperatures - Thermal cycling stability - Excellent electrical insulation - Chemical resistance - Low stress on sensitive components - Hydrolytic stability

The 20-2362FR potting and encapsulating compound has been formulated to meet the stringent non-burning requirements of UL 94 V-0. 20-2362FR is listed with Underwriter's Laboratory for passing UL 94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has a glass transition temperature of -72 ° C, and has low moisture permeability. This product forms a soft elastomer that will cushion and protect sensitive electronic components. Features: - Flame Retardant - UL 94 V-0 listed - Low Viscosity - Low Durometer - Low shrinkage and exotherm - Excellent moisture resistance - Maintains flexibility at low temperatures - RoHS and REACH compliant Benefits: - May be used in applications requiring FR - Quick self-leveling around components - Low stress on components & vibration resistance - Will not damage components during cure - Will not absorb H 2 O and can be used in wet environments - Can be used in very cold environments - Finished products are export compliant

This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. These unique urethane formulations maintain their integrity over a wide operating temperature range. The low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. These systems exhibit very little hardness increase when cooled to -72°C. Features: - Maintains flexibility at low temperatures - Thermal cycling stability - Excellent electrical insulation - Chemical resistance - Low stress on sensitive components - Hydrolytic stability

This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. These unique urethane formulations maintain their integrity over a wide operating temperature range. The low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. These systems exhibit very little hardness increase when cooled to -72°C. Features: - Maintains flexibility at low temperatures - Thermal cycling stability - Excellent electrical insulation - Chemical resistance - Low stress on sensitive components - Hydrolytic stability

20-2521 is a high performance two component urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2521 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system is also well known for its outstanding thermal shock and excellent dielectric properties. 20-2521 is ideal for potting applications where a wide operating temperature (-55 to +130°C) is required. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. Features: - Does not contain MOCA or TDI - Low stress on components - Excellent dielectric properties - Low viscosity - Easy to handle - Low shrinkage - Very good thermal shock and vibration resistance - Hydrolytic stability

20-2523 is a high performance two component urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2523 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system is also well known for its outstanding thermal shock and excellent dielectric properties. 20-2523 is ideal for potting applications where a wide operating temperature (-55 to +130°C) is required. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. Features: - Does not contain MOCA or TDI - Low stress on components - Excellent dielectric properties - Low viscosity - Easy to handle - Low shrinkage - Very good thermal shock and vibration resistance - Hydrolytic stability

20-2621 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. 20-2621 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. This product has a convenient one to one mix ratio and is considered DOT non-hazardous. This product is packaged in the convenient TriggerBond® system. Features: - Water Clear - Semi-Flexible - Excellent Environmental Resistance - Non-Yellowing

50-2366FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy. 50-2366FR is suitable for outdoor use. For a very fast curing version of this product consider the 50-2370FR. This product will be tack free in 20 minutes. Features: - Low viscosity - Low stress on sensitive components - Excellent electrical insulation - Excellent water resistance - Low shrinkage - Thermal shock resistance - Thermally conductive - Flame retardant

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-0. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-0. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy. 50-2369 FR is suitable for outdoor use. Features: - Low viscosity - Low stress on sensitive components - Excellent electrical insulation - Excellent water resistance - Low shrinkage - Thermal shock resistance - Thermally conductive - Flame retardant (UL 94 V-O Listed)

UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for deep section curing. Features: - Low viscosity - Exterior durability - Good toughness - Excellent adhesion to difficult substrates

UV Cure 60-7111 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7111 also has high impact strength and flexibility. This material is a good choice when water and weather resistance is important. UV Cure 60-7112 is a higher viscosity version (7,000 cps) of the 60-7111. Features: - Weather Resistant - Excellent Adhesion - High Impact Strength - High Flexibility

UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good choice for potting electronic assemblies exposed to excessive moisture. UV Cure 7114 has very good adhesion to metal and plastic substrates. Features: - Excellent Water Resistance - Good Electrical Insulation Properties - Good Toughness - Good Adhesion to most substrates

70-2170 is a liquid, low viscosity, urethane resin formulated for casting dimensionally stable parts. Parts cast with 70-2170 have an ABS feel and appearance. 70-2170 is mercury free and does not contain TDI or MbOCA. Its low shrinkage and low viscosity allow for the production of precision parts. This is an ideal prototyping material due to the following properties: - High Impact Resistance - Fast Room Temperature Cure - Dimensionally Stable - High Durometer - Excellent Machinability - Convenient Mix Ratio

DC-2606 is a two component, low viscosity polyurethane doming resin. This decorative resin system is designed for continuous outdoor exposure. It remains crystal clear and resists yellowing. DC-2606 forms a durable 3D lens effect on labels, decals, badges, name-plates, lapel pins, automotive hood ornaments, etc... This system cures at room temperature and has a convenient 1:1 mix ratio. Features: - Low Viscosity - Formulated for Outdoors - Crystal Clear - Available in Dual Barrel Cartridges - One to One Ratio - Contains No Solvents