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STYCAST® 50500-1

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
STYCAST 50500-1 fill encapsulant is designed to be used with STYCAST 50300 HT dam encapsulant in glob top applications. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Processing Method
Encapsulating
Other Properties
Filler / Reinforcement, Features, Appearance, Shore Hardness, Glass Transition Temperature, CLTE, Flow (TMA), Thermal Conductivity, Dielectric Constant, Dissipation Factor, Additional Properties, Solids Content, Density, Viscosity, Curing Time, Shelf Life
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Processing

Find specific processing information for STYCAST® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

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