STYCAST 2017M4 is an epoxy encapsulant developed for blue Light Emitting Diodes.

STYCAST 2850KT CATALYST 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern. STYCAST 2850KT can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.

STYCAST 2850KT CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern. STYCAST 2850KT can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - Two component - Low CTE - High thermal conductivity - Thermally conductive - Electrically insulative - General purpose - Good chemical resistance - Good physical strength

STYCAST 3050 Catalyst 9 is designed for potting and encapsulation applications with very small physical spacing between parts. The filler system is non-abrasive and readily machinable. This is a consideration when using a dispensing equipment or where subsequent machining of the cured part is required. STYCAST 3050 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - Very low viscosity - Excellent penetration into tightly packed assemblies - Good machinability - General purpose - Room temperature cure - Good chemical resistance - Good physical strength

STYCAST 50500-1 fill encapsulant is designed to be used with STYCAST 50300 HT dam encapsulant in glob top applications. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.

STYCAST 50500D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required. Product Benefits - Low modulus of elasticity - Low stress - High purity - Non-sag - Low warpage

One Component, Fast Curing, Low Viscosity Underfill Encapsulant STYCAST A 312 is a one component, unfilled, solventless epoxy underfill encapsulant. STYCAST A 312 is a fast curing product with excellent chemical, heat and moisture resistance combined with good dielectric properties. Application STYCAST A 312 can be used as capillary flow underfill on CSP & BGA devices. STYCAST A 312 improves the attachment strength of CSP & BGA devices during mechanical stress testing such as drop and bend testing.

STYCAST A 312-20 is a one component heat cured, slightly thixotropic 100% solids, liquid epoxy adhesive and insulation compound. STYCAST A 312-20 will cure as low as 100°C. Applications: STYCAST A 312-20 is a Class B (130°C) product, has excellent chemical, heat, and moisture resistance and has good dielectric properties.

STYCAST NX-17 is a one-component thermosetting clear encapsulant developed for SMD-type LEDs. The product features a low viscosity that enables easy handling, and strong adhesion to case and lead frame that realizes highly reliable LEDs with excellent heat shock performance. Applications: STYCAST NX-17 can be used as clear encapsulant for many types of SMD LEDs. The product is particularly suitable for top-view type that requires high reliability, such as those for automotive applications.