A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low outgassing epoxy.

EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a low viscosity version of EPO-TEK® 921.

A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.

A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics. It is a lower viscosity and smaller particle size alternative to EPO-TEK® 930.

EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. It can be used as the main gasket seal of glass plates in LCDs or sealing filter windows onto opto-sensors.

A version of EPO-TEK® B9021-1 suggested for improved insulation and LCD gasket sealing.

A single component, thermally conductive, B-Stage epoxy paste.

A single component, electrically and thermally insulating epoxy designed for adhesive, sealing and potting of micro-electronics and semiconductor devices. It can be used in many industries such as military, automotive, optical or medical electronics.

A single component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing rheology. It can be used for thermal dissipation when bonding chips, SMDs, PCBs or heat sinks.

A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates.

EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging.

EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.

EPO-TEK® E2001-6 is a two component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a two component version of EPO-TEK® E3001-6.

EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.

A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests.

EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications.

EPO-TEK® E3001 is a one component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.

EPO-TEK® E3001-6 is a single component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK® E2001-6, shipped in dry ice.

EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe.

EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.

A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.

A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.

EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.

EPO-TEK® E4110-LV is a two component, silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.

EPO-TEK® E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.

A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.

EPO-TEK® EE149-6 is a single component, silver-filled, electrically conductive B-stageable designed for semiconductor flip chips and hybrid microelectronics.

A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing.

EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 C, although other heat cures can be used.

EPO-TEK® EJ2189-LV is an electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.

EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance designed for the demanding requirements of high power LED die attach applications. It is the single component version of EPO-TEK® EK2000.

A single component, longer dry time version of EPO-TEK EK1000 designed for applications requiring longer working times.

A single component, electrically conductive epoxy with exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK EK1000-MP and is designed for applications requiring long work times including hybrid die and component attach. Complies with the requirements of MIL-STD 883/Test Method 5011.

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Complies with the requirements of MIL-STD 883/Test Method 5011. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques

A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It is a two component version of EPO-TEK® EK1000.

EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.

A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.