Two-component encapsulating system based on polyurethane. The resin component is formulated with a mineral filler which provides self-extinguishing properties without use of halogen compounds. The material achieves UL 94 V-0 properties at a thickness of 6,0 mm and is approved and listed under the File No. E108835.This highly flexible system exhibits outstanding chemical resistance against most common acids and alkali solutions and an excellent flexibility at low temperatures. Temperature range of use: -60°C to +125°C. The casting resin is used with WEVONAT 300 . Applications: Encapsulation and coating of pressure sensitive electrical and electronic compo-nents, e.g. sensors and SMD-equipped PCBs.

Two-component encapsulating system based on polyurethane. This highly flexible system exhibits outstanding chemical resistance against most common acids and alkali solutions and an excellent flexibility at low temperatures. The product processes a very low and stable dielectric constant over a wide variety of frequencies and broad temperature range. Additionally it shows very good adhesion to most plastic materials, metals and glass. Temperature range of use: -60°C to +125°C. The casting resin is used with WEVONAT 385 . Applications: Encapsulation and coating of pressure sensitive electrical and electronic compo-nents, e.g. sensors and SMD-equipped PCBs.

Two-component encapsulating system based on polyurethane with high thermal conductivity. This highly flexible system exhibits outstanding chemical resistance against most common acids and alkali solutions and an excellent flexibility at low temperatures. The product processes a very low and stable dielectric constant over a wide variety of frequencies and broad temperature range. The system is tested by Underwriters Laboratories under the File-No. E108835 at a thickness of 4 mm according to UL 94 V-0 Temperature range of use: -60°C to +120°C. The casting resin is used with WEVONAT 385 Applications: Encapsulation and coating of pressure sensitive electrical and electronic components, e.g. sensors and SMD-equipped PCBs.