Epoxy: EPO-TEK®
Produto | Disponibilidade | Descrição do produto |
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EPO-TEK® E4110 | África & Oriente Médio |
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
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EPO-TEK® E4110-LV | África & Oriente Médio |
EPO-TEK® E4110-LV is a two component, silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.
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EPO-TEK® E4110-PFC | África & Oriente Médio |
EPO-TEK® E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
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EPO-TEK® ED1020 | África & Oriente Médio |
A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.
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EPO-TEK® EE149-6 | África & Oriente Médio |
EPO-TEK® EE149-6 is a single component, silver-filled, electrically conductive B-stageable designed for semiconductor flip chips and hybrid microelectronics.
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EPO-TEK® EE165-3 | África & Oriente Médio |
A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing.
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EPO-TEK® EJ2189 | África & Oriente Médio |
EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 C, although other heat cures can be used.
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EPO-TEK® EJ2189-LV | África & Oriente Médio |
EPO-TEK® EJ2189-LV is an electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
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EPO-TEK® EK1000 | África & Oriente Médio |
EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance designed for the demanding requirements of high power LED die attach applications. It is the single component version of EPO-TEK® EK2000.
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EPO-TEK® EK1000-1 | África & Oriente Médio |
A single component, longer dry time version of EPO-TEK EK1000 designed for applications requiring longer working times.
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EPO-TEK® EK1000-1MP | África & Oriente Médio |
A single component, electrically conductive epoxy with exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK EK1000-MP and is designed for applications requiring long work times including hybrid die and component attach. Complies with the requirements of MIL-STD 883/Test Method 5011.
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EPO-TEK® EK1000-MP | África & Oriente Médio |
A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Complies with the requirements of MIL-STD 883/Test Method 5011. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques
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EPO-TEK® EK2000 | África & Oriente Médio |
A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It is a two component version of EPO-TEK® EK1000.
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EPO-TEK® EM127 | África & Oriente Médio |
EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
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EPO-TEK® EV2118-2 | África & Oriente Médio |
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
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EPO-TEK® GD2191 | África & Oriente Médio |
A two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
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EPO-TEK® GE116 | África & Oriente Médio |
A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM. It is a red color version of EPO-TEK® 115-SMT.
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EPO-TEK® GE120 | África & Oriente Médio |
A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM. It is a blue color version of EPO-TEK® 115-SMT.
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EPO-TEK® H20E | África & Oriente Médio |
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.
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EPO-TEK® H20E-175 | África & Oriente Médio |
EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
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EPO-TEK® H20E-8 | África & Oriente Médio |
EPO-TEK ® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
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EPO-TEK® H20E-D | África & Oriente Médio |
EPO-TEK® H20E-D is a single component, 100% solids, silver-filled epoxy designed for electrically and thermally conductive bonds. It is an enhanced version of EPO-TEK® H20E.
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EPO-TEK® H20E-FC | África & Oriente Médio |
EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.
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EPO-TEK® H20E-HC | África & Oriente Médio |
EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK H20E.
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EPO-TEK® H20E-LC | África & Oriente Médio |
EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low chloride applications.
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EPO-TEK® H20E-LV | África & Oriente Médio |
EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy.
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EPO-TEK® H20E-MP | África & Oriente Médio |
EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.
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EPO-TEK® H20E-PFC | África & Oriente Médio |
EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
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EPO-TEK® H20E-SLR | África & Oriente Médio |
EPO-TEK® H20E-SLR is a two-component, electrically conductive, epoxy adhesive designed for meter mix dispensing applications. It is desgined for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels.
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EPO-TEK® H20E-SLR-HV | África & Oriente Médio |
EPO-TEK® H20E-SLR-HV is a two-component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. It is a higher viscosity version of EPO-TEK H20E-SLR.
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EPO-TEK® H20E-SLR-HVMX | África & Oriente Médio |
EPO-TEK® H20E-SLR-HVMX is a two-component, electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. It is a higher viscosity version of EPO-TEK H20E-SLR-MX.
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EPO-TEK® H20E-SLR-MX | África & Oriente Médio |
EPO-TEK® H20E-SLR-MX is a two-component, electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels.
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EPO-TEK® H20F | África & Oriente Médio |
EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.
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EPO-TEK® H20S | África & Oriente Médio |
EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.
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EPO-TEK® H20S-D | África & Oriente Médio |
A single component, silver-filled epoxy with a smooth, thixotropic consistency. It is a version of EPO-TEK® H20S designed primarily for enhanced dispensing.
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EPO-TEK® H21D | África & Oriente Médio |
EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.
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EPO-TEK® H22 | África & Oriente Médio |
EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
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EPO-TEK® H24 | África & Oriente Médio |
EPO-TEK ® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.
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EPO-TEK® H27D | África & Oriente Médio |
EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.
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EPO-TEK® H31 | África & Oriente Médio |
EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.
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