Two component, thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation applications. Replacement for EPO-TEK® T905.

EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.

EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications

EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.

EPO-TEK® TD1001-67 is a soft single component, thermally conductive, electrically insulating epoxy. It is a more compliant version of EPO-TEK® TD1001.

EPO-TEK® TJ1104-LH is a black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.

A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.

EPO-TEK® TV2001 is a two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.

EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.

A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.

Optically clear UV curable adhesive and encapsulant designed to resist discoloration during solder reflow processing.

EPO-TEK® UJ1190 is a clear, UV curable adhesive.