GLPOLY Two part thermal gel pad / XK-S20
1:1 mix
(no cure by-product)
Low stress applications
Easy to use
Fast cure by heating
Applications:
Automotive electronics
Telecommunications
Computer&peripherals
Thermally conductive &
vibration dampening
Between any
heat-generating
semiconductor and
a heat sink
一般属性
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Technical Datasheet (English)
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购买地点
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