Prospector

热塑性,未指定(TP,未指定) by 深圳市金菱通达电子有限公司

产品 可用性 产品说明
GLPOLY Electrical Insulation thermal interface / PCM XK-C16 北美洲
XK-C16 is produced on the basis of phase changing properties Non-silicone with excellent dielectric and mechanical strength Features: Special design for easy use and storage High viscosity (at 80°) will not drip or run like grease Applications: High performance computer processors Graphic cards
GLPOLY Hi Frequency EMI absorber / XK-A100 北美洲
During the 30MHz ~ 20GHz frequency range, electromagnetic radiation and magnetic interference can be absorb effectively. Suitable for solving electromagnetic interference radio frequency interference which generated by electronic devices or radio frequency interference. Features: 30 MHZ~2O GHZ full frequency high absorption rate, comprehensively eliminate electromagnetic wave. Application: Cellular phones /Telecommunications / Camera RF module /FPC / high frequency IC chip
GLPOLY Low Density Thermal Gel Pad For Vehicle / XK-P10LD 北美洲
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution. This series of products are resilient and good amount of deformationn Suitable for large institutional,design tolerances, Product is Low Density The double layer use of special ultra-thin fabric reinforcement, whether punching punch, strip type, malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel. Completely non-toxic and green products accord to international requirements. Features: Low density Ultra conformable Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance
GLPOLY Low Density Thermal Gel Pad For Vehicle / XK-P20LD 北美洲
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution. This series of products are resilient and good amount of deformation suitable for large institutional,design tolerances, Product is Low Density. The Double layer use of special ultra-thin fabric reinforcement, whether punching punch, strip type, Malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel completely non-toxic and green products accord to international requirements Features: Low density Ultra conformable Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance
GLPOLY Non-Silicone grease / XK-XN4O 北美洲
Non silicone grease has been engineered to solve the problems of contamination and migration. The compound is Polysynthetic based. Thermal grease is used for rapid and efficient heat transfer. Features: Non-silicone Non-curing Resists pumping-out Applications: Computer CPU LED Light
GLPOLY Non-Silicone Putty Gel / XK-GN30 北美洲
Syringes packaging, automated production, high temperature, non-corrosive to metal, 100% thermal curing putty. Non Silicone Gel is high thermal www.glpoly.comperformance Gel , it based on TPR, Filled with a variety of high performance ceramic powder. It also has high thermal conductivity low thermal resistance, good insulation characteristics . Features: Good compressibility Non-silicone Non-curing Resists pump-out Applications: Consumer electronics Automotive Systems Telecommunications
GLPOLY Non-Silicone Thermal Fiberglass / XK-FN30 北美洲
XK-FN Non-silicone thermally conductive fiberglass for silicone-sensitive applications. (EX: LED , Telecom and Aerospace ). Ceramic filled and polyester resins coated either side Features: Polyester based Designed for silicone-sensitive standard applications Applications: Power semiconductors Power supplies LED
GLPOLY Thermal Pad / XK-P20 北美洲
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra—thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products". Features: Ultra conformable, "gel-like" modulus Designed for low-stress applications low hardness Application: Telecommunications Computer, Between heat—generating semiconductor and a heat sink
GLPOLY Thermal Pad / XK-P20S 北美洲
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra—thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products". Features: Ultra conformable, "gel-like" modulus Designed for low-stress applications low hardness Application: Telecommunications Computer, Between heat—generating semiconductor and a heat sink
GLPOLY Thermally Conductive EMI Absorber / XK-J25 北美洲
Both issues of thermal conductivity and Electromagnetic absorber can be solved at the same time in the limited space and time. Also simplify the mechanical design costs. Soft silicone base can reduce Internal stress and tolerance and make the terminal product design more reliable. Features: Effectively absorb and damp a wide range of electromagnetic waves Easily filling small gaps and uneven surfaces with soft gel Applications: a wide temperature range because of the inherent advantages of silicone gel
GLPOLY Two part thermal gel pad / XK-S20 北美洲
Features: 1:1 mix (no cure by-product) Low stress applications Easy to use Fast cure by heating Applications: Automotive electronics Telecommunications Computer&peripherals Thermally conductive & vibration dampening Between any heat-generating semiconductor and a heat sink
GLPOLY Two part thermal gel pad / XK-S30 北美洲
Features: 1:1 mix (no cure by-product) Low stress applications Easy to use Fast cure by heating Applications: Automotive electronics Telecommunications Computer&peripherals Thermally conductive & vibration dampening Between any heat-generating semiconductor and a heat sink
GLPOLY Two part thermal gel pad / XK-S40 北美洲
Features: 1:1 mix (no cure by-product) Low stress applications Easy to use Fast cure by heating Applications: Automotive electronics Telecommunications Computer&peripherals Thermally conductive & vibration dampening Between any heat-generating semiconductor and a heat sink
GLPOLY Ultra Soft Thermal Pad / XK-P10F 北美洲
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products". Features: Ultra soft (shore00=10 ) Low Oil Bleeding Low Contact Resistance Excellent mechanical stability
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