GLPOLY Thermal Pad / XK-P20
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra—thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products".
Features:
Ultra conformable, "gel-like" modulus
Designed for low-stress applications
low hardness
Application:
Telecommunications
Computer, Between heat—generating
semiconductor and a heat sink
Features:
Ultra conformable, "gel-like" modulus
Designed for low-stress applications
low hardness
Application:
Telecommunications
Computer, Between heat—generating
semiconductor and a heat sink
一般属性
使用 Prospector 建立免費帳戶時，可造訪 GLPOLY Thermal Pad / XK-P20 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
Semiconductive Shield
其他属性
特性, 外观, 密度 / 比重, 抗张强度, 断裂伸长率, 肖氏硬度, 导热系数, 体积电阻率, 介电强度, 介电常数, UL 阻燃等级, 其他性能
加工
Find specific processing information for GLPOLY as well as general information for the 热塑性，未指定 generic family. 注册 或 登录 了解更多信息。
购买地点
您可以從 1 個經銷商或製造商處購買 GLPOLY Thermal Pad / XK-P20。 注册 或 登录 了解更多信息。
