Epoxid (Epoxid): Epoxid
Produkt | Verfügbarkeit | Produktbeschreibung |
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EPO-TEK® 920 | Afrika und Mittlerer Osten |
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low outgassing epoxy.
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EPO-TEK® 920-FL | Afrika und Mittlerer Osten |
EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
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EPO-TEK® 921 | Afrika und Mittlerer Osten |
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
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EPO-TEK® 921-FL | Afrika und Mittlerer Osten |
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a low viscosity version of EPO-TEK® 921.
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EPO-TEK® 930 | Afrika und Mittlerer Osten |
A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.
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EPO-TEK® 930-1 | Afrika und Mittlerer Osten |
A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics. It is a lower viscosity and smaller particle size alternative to EPO-TEK® 930.
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EPO-TEK® 930-4 | Afrika und Mittlerer Osten |
EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
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EPO-TEK® B9021 | Afrika und Mittlerer Osten |
A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. It can be used as the main gasket seal of glass plates in LCDs or sealing filter windows onto opto-sensors.
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EPO-TEK® B9021-14 | Afrika und Mittlerer Osten |
A version of EPO-TEK® B9021-1 suggested for improved insulation and LCD gasket sealing.
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EPO-TEK® B9021-15 | Afrika und Mittlerer Osten |
A single component, thermally conductive, B-Stage epoxy paste.
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EPO-TEK® B9101-2 Unfilled | Afrika und Mittlerer Osten |
A single component, electrically and thermally insulating epoxy designed for adhesive, sealing and potting of micro-electronics and semiconductor devices. It can be used in many industries such as military, automotive, optical or medical electronics.
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EPO-TEK® B9126-7 | Afrika und Mittlerer Osten |
A single component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing rheology. It can be used for thermal dissipation when bonding chips, SMDs, PCBs or heat sinks.
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EPO-TEK® B9126-8 | Afrika und Mittlerer Osten |
A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates.
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EPO-TEK® CF6-2 | Afrika und Mittlerer Osten |
EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging.
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EPO-TEK® E2001 | Afrika und Mittlerer Osten |
EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
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EPO-TEK® E2001-6 | Afrika und Mittlerer Osten |
EPO-TEK® E2001-6 is a two component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a two component version of EPO-TEK® E3001-6.
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EPO-TEK® E2001-HV | Afrika und Mittlerer Osten |
EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.
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EPO-TEK® E2036 | Afrika und Mittlerer Osten |
A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests.
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EPO-TEK® E2101 | Afrika und Mittlerer Osten |
EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications.
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EPO-TEK® E3001 | Afrika und Mittlerer Osten |
EPO-TEK® E3001 is a one component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
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EPO-TEK® E3001-6 | Afrika und Mittlerer Osten |
EPO-TEK® E3001-6 is a single component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK® E2001-6, shipped in dry ice.
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EPO-TEK® E3001-HV | Afrika und Mittlerer Osten |
EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe.
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EPO-TEK® E3035 | Afrika und Mittlerer Osten |
EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.
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EPO-TEK® E3037 | Afrika und Mittlerer Osten |
A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.
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EPO-TEK® E3037-LV | Afrika und Mittlerer Osten |
A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.
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EPO-TEK® E4110 | Afrika und Mittlerer Osten |
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
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EPO-TEK® E4110-LV | Afrika und Mittlerer Osten |
EPO-TEK® E4110-LV is a two component, silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.
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EPO-TEK® E4110-PFC | Afrika und Mittlerer Osten |
EPO-TEK® E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
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EPO-TEK® ED1020 | Afrika und Mittlerer Osten |
A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.
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EPO-TEK® EE149-6 | Afrika und Mittlerer Osten |
EPO-TEK® EE149-6 is a single component, silver-filled, electrically conductive B-stageable designed for semiconductor flip chips and hybrid microelectronics.
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EPO-TEK® EE165-3 | Afrika und Mittlerer Osten |
A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing.
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EPO-TEK® EJ2189 | Afrika und Mittlerer Osten |
EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 C, although other heat cures can be used.
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EPO-TEK® EJ2189-LV | Afrika und Mittlerer Osten |
EPO-TEK® EJ2189-LV is an electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
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EPO-TEK® EK1000 | Afrika und Mittlerer Osten |
EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance designed for the demanding requirements of high power LED die attach applications. It is the single component version of EPO-TEK® EK2000.
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EPO-TEK® EK1000-1 | Afrika und Mittlerer Osten |
A single component, longer dry time version of EPO-TEK EK1000 designed for applications requiring longer working times.
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EPO-TEK® EK1000-1MP | Afrika und Mittlerer Osten |
A single component, electrically conductive epoxy with exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK EK1000-MP and is designed for applications requiring long work times including hybrid die and component attach. Complies with the requirements of MIL-STD 883/Test Method 5011.
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EPO-TEK® EK1000-MP | Afrika und Mittlerer Osten |
A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Complies with the requirements of MIL-STD 883/Test Method 5011. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques
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EPO-TEK® EK2000 | Afrika und Mittlerer Osten |
A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It is a two component version of EPO-TEK® EK1000.
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EPO-TEK® EM127 | Afrika und Mittlerer Osten |
EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
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EPO-TEK® EV2118-2 | Afrika und Mittlerer Osten |
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
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