EPO-TEK® OG142-112 is a single component, low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.

EPO-TEK® OG142-87 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. It is a replacement version of EPO-TEK® OG142-13 with better bonding strength and moisture resistance.

EPO-TEK® OG142-95 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. It is a replacement version of EPO-TEK® OG142-17 with better bonding strength and moisture resistance.

EPO-TEK® OG154-1 is a single component, UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry. It is a replacement for EPO-TEK® OG154.

EPO-TEK® OG159-2 is a single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications include semiconductor, electro-optics, fiber optic, and scientific/OEM. It can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing, and encapsulating devices.

A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, all-purpose adhesive.

EPO-TEK® OG198-54 is a single component, low viscosity, electrically and thermally insulating UV cure, medical grade epoxy.

EPO-TEK® OG198-55 is a high viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is the more thixotropic version of EPO-TEK® OG198-54.

A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB level electro-optics. It can also be used for sealing and coating applications.

UV curable adhesive designed for glob top encapsulation

A UV fast curing, optically clear adhesive offering compliance and high strength.

Two component, general purpose, very fast setting epoxy adhesive.

Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND

EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors.

A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.

A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

EPO-TEK® T6067-3 is a single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.

EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries.

EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14.

A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.

EPO-TEK® T7109-19 is a two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.

Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.

EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

Two component thermally conductive epoxy used for potting and encapsulating.

EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

Two component, thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation applications. Replacement for EPO-TEK® T905.

EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.

EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications

EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.

EPO-TEK® TD1001-67 is a soft single component, thermally conductive, electrically insulating epoxy. It is a more compliant version of EPO-TEK® TD1001.

EPO-TEK® TJ1104-LH is a black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.

A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.

EPO-TEK® TV2001 is a two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.

EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.

A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.

Optically clear UV curable adhesive and encapsulant designed to resist discoloration during solder reflow processing.

EPO-TEK® UJ1190 is a clear, UV curable adhesive.

EpoxAcast™ 650 and EpoxAcast™ 650 BLACK are mineral filled general purpose casting epoxies that are low cost and versatile. They feature a low mixed viscosity for minimal bubble entrapment. Choose Fast, Medium or Slow catalyst to fit your project. You can also use HT Hardener to give your castings higher heat resistance. EpoxAcast™ 650 and EpoxAcast™ 650 BLACK are used for making hard dies for metal stamping as well as patterns and fixtures. They are also used for electrical encapsulation to extend the life cycles and enhance the performance of potted electronic devices. The high compressive strength of EpoxAcast™ 650 and EpoxAcast™ 650 BLACK makes it ideal for making stamping dies for production pressing of metal ornaments.

EpoxAcast™ 650 is a mineral filled general purpose casting epoxy that is low cost and versatile. It features a low mixed viscosity for minimal bubble entrapment. Choose Fast, Medium or Slow catalyst to fit your project. You can also use HT Hardener to give your castings higher heat resistance. EpoxAcast™ 650 is used for making hard dies for metal stamping as well as patterns and fixtures. It is also used for electrical encapsulation to extend the life cycles and enhance the performance of potted electronic devices. The high compressive strength of EpoxAcast™ 650 makes it ideal for making stamping dies for production pressing of metal ornaments.

EpoxAcast™ 655 (formerly Metalset™ A-30) is a versatile aluminum filled castable epoxy that is very hard and strong. It is dimensionally stable, even when mass cast up to 512 in3/ 8,390 cm3. Different hardener speed options are available depending on your project requirements. Maximum heat resistance is achieved using HT HIGH TEMP hardener (up to 225°F/108°C). Cured EpoxAcast™ 655 epoxy has high physical properties and is used for a variety of applications including making hard tooling, vacuum forming dies/molds, injection molds, foundry patterns, jigs and fixtures and metal forming dies. Depending on project requirements, Part A Base can be mixed with 101 FAST, 102 MEDIUM, 103 SLOW or HT HIGH TEMP hardeners.