DESCRIPTION: Epocast® 1626-C1/D2 epoxy syntactic foam is a fast-setting, two-component material designed for core filling, edge sealing, and bushing and fastener potting of honeycomb structures. The easy-handling viscous paste has low-flow characteristics. Epocast® 1626-C1/D2 epoxy syntactic foam is a toughened system which resists cracking and is especially suited for applications of high vibration and wide temperature cycling. This product has good retention of strength after environmental aging. Epocast® 1626-C1/D2 epoxy syntactic foam is qualified to BMS 5-28, Type 26 and SMS 116201, Type 3.

DESCRIPTION: Epocast® 1627-2 epoxy syntactic is a filled, high-performance, structural core-reinforcing compound with an extremely low coefficient of thermal expansion, making the material suitable for use in fabricating and reinforcing composite structures. The epoxy syntactic is supplied ready to use (after thawing) as a gray-colored, frozen, 32- or 64-cubic inch (524 or 1,049 cm 3 ) patty which does not require any weighing or mixing. Epocast® 1627-2 epoxy syntactic is qualified to BMS 5-28, Type 27.

DESCRIPTION: Epocast® 1628-A epoxy resin is a soft white paste that, after blending with yellow-colored Epocast® 1628-B hardener, becomes a pale yellow, ultra low density epoxy syntactic for edge reinforcing of honeycomb structures. The lightweight epoxy paste can be spread with a putty knife or trowel to fill honeycomb core sections or edges of composite sandwich constructions. Epocast® 1628-A/B epoxy syntactic can be easily sanded or machined after cure. Epocast® 1628-A/B epoxy syntactic is qualified to BMS 5-28, Type 28.

DESCRIPTION: Epocast® 1629-A/B epoxy syntactic is a beige-tan, self-extinguishing, ultra-low density system for edge reinforcing of honeycomb structures. It can be extruded or spread with a putty knife and resists slumping on vertical surfaces. Epocast® 1629-A/B epoxy syntactic sands and machines easily when cured. It is a non-PBDE containing material and can be used as a replacement for Epocast® 87005 A/B-80 epoxy syntactic, Epocast® 87005 A/B-60 epoxy syntactic, Epocast® 87269 A/B epoxy syntactic, Epocast® 87005 A/B-61 epoxy syntactic, and Epocast® 87005 A/BE- 60 epoxy syntactic.

DESCRIPTION: Epocast® 1633-A/B epoxy syntactic is a medium paste, halogen-free self-extinguishing compound designed for potting fasteners in honeycomb structures. The epoxy syntactic is easily extruded through 1/8 in. (3mm) nozzle orifice, but is non-flowing after application. It is easy to handle in isolated repair areas because the syntactic paste is available in dual-barrel cartridges. Epocast® 1633-A/B epoxy syntactic sets quickly at room temperature.

Description: Epocast® 1635-A/B syntactic compound is a two-component, high-performance material designed for refilling mis-drilled holes in composite parts. This aluminum filled, high-viscosity system exhibits outstanding compressive strength and dynamic fatigue resistance under load at elevated temperature. This product is qualified to BMS 5-28, Type 31.

DESCRIPTION: Epocast ® 1636-A/B epoxy syntactic is a high-performance, two-part system with high strength and good high temperature resistance. The aluminum-filled, medium-viscosity epoxy compound is easy to handle and machines easily in the cured state. Epocast ® 1636-A/B epoxy syntactic is used to reinforce honeycomb structures and is qualified to BMS 5-28, Type 6.

DESCRIPTION: Epocast ® 1652-A/B epoxy syntactic is a low-density system with good elevated temperature performance after a room-temperature cure. The epoxy syntactic is suitable for core filling metal skins, adding stiffness and strength to fabricated parts such as helicopter rotor blades, core splicing, and strengthening radii and corners of reinforced plastic structures. Epocast ® 1652-A/B epoxy syntactic is qualified to Grumman GM 4006, Gulfstream GMS 4005 and Sikorsky 9587, Type 2.

DESCRIPTION: Epocast® 1661 epoxy syntactic is a frozen, one-component compound supplied in patty form. After thawing, the patty can be placed onto honeycomb for vacuum bag application. Epocast® 1661 epoxy syntactic may be used for fastener potting, panel edge filling and honeycomb reinforcing.

DESCRIPTION: Epocast® 167-A/B epoxy syntactic is a low-density, white, two-part system designed for insert potting and edge trim bonding in light weight honeycomb applications requiring a pourable, room-temperature curable material. Epocast® 167-A/B epoxy syntactic is qualified to BMS 5-28, Type 1.

DESCRIPTION: Epocast® 169A-1 Resin / 946 Hardener is a two-component, low-density, pourable epoxy system which cures at room temperature to a carvable, wood-like product. This epoxy syntactic system has good dimensional stability under changing humidity conditions. Epocast® 169A-1 resin / 946 hardener system is easy to use and is suitable for core filling and reinforcing honeycomb panels. It is qualified to SS-9587, Type 1.

DESCRIPTION: Epocast® 169A-1 Resin / 9615 Hardener is a two-component, low-density epoxy syntactic which cures at room temperature to a carvable, wood-like product. The cured Epocast® 169A-1 Resin / 9615 Hardener system has good dimensional stability under changing humidity conditions. Epocast® 169A-1 Resin / 9615 Hardener is qualified to SS-9587, Type 1.

DESCRIPTION: Epocast® 169A-1 resin with 9646 Hardener epoxy syntactic is a low-density foam which cures at room temperature to a carvable, woodlike product. The epoxy syntactic has good dimensional stability under changing humidity conditions and is pourable for easier application as a core fill and honeycomb reinforcement. Epocast® 169A-1 resin can also be used with 9646-A Hardener at the same mix ratio, to produce a non-flow paste consistency.

DESCRIPTION: EpoCast® 35-A/9216 resin is a two component, amber colored laminating resin designed for foundry applications and core supports, bonding fixtures, die facing for shaping heated metals and high temperature tools for urethane foaming. EpoCast® 35-A/9216 resin features excellent wetability of glass fabrics, quick setting at room temperature and excellent ser\/iceability up to 400°F.

DESCRIPTION : Epocast® 35-A resin/Hardener 927 epoxy laminating system is a two-component, solvent-free material designed to perform at temperatures up to 300°F (149°C). The medium-viscosity liquid laminating system readily wets glass fabrics; its long work life supports extended fabrication times for large composite repairs. Epocast® 35-A resin/Hardener 927 epoxy laminating system is well suited for repair or fabrication of laminated composite structures and other applications requiring good high-temperatures properties. Epocast® 35-A resin/Hardener 927 epoxy laminating system is qualified to BMS 8-214.

DESCRIPTION: Epocast® 50-A1 Resin/Hardener 946 epoxy laminating system is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. Epocast ® 50-A1 resin/Hardener 946 epoxy laminating system is self extinguishing. Epocast ® 50-A1 / Hardener 946 is qualified to BMS 8-201, Type IV, Rev. F. This product is also available in a longer work life version - Epocast ® 50-A1 resin/Hardener 9816 epoxy laminating system.

DESCRIPTION: Epocast ® 50-A1 Resin/Hardener 9816 epoxy laminating system is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. Epocast® 50-A1 resin/Hardener 9816 epoxy laminating system is self extinguishing. Epocast ® 50-A1 / Hardener 9816 is qualified to BMS 8-201, Type III, Rev. F. This product is also available in a shorter work life version - Epocast ® 50-A1 resin/Hardener 946 epoxy laminating system.

DESCRIPTION : Epocast® 52-A/B epoxy laminating system is a two-part material formulated for service up to 350°F (177°C). Well suited for fabrication and repair of graphite composites, the laminating system combines low temperature vacuum bag curing capability with good hot-wet strength. Epocast® 52-A/B epoxy laminating system is qualified to specifications including: BMS 8-301, Class 1, Grade 2; AIMS 08-01-002-01; and AIMS 08-02-002-01.

DESCRIPTION: Epocast® 54-A/B epoxy laminating system is an unfilled, solvent-free, easy-to-handle product. It is self extinguishing and well suited for the manufacture and repair of composite structures. In addition to laminating applications, the epoxy system can be used for filament winding. Epocast® 54-A/B epoxy laminating system is qualified to AIMS 04-27-000-01.

DESCRIPTION: Epocast® 8623-A/Hardener 946 epoxy syntactic is a two-part, core-filling compound with a soft paste viscosity that provides for easy extrudability through a 1/8-in. (3mm) nozzle. Epocast® 8623-A/Hardener 946 epoxy syntactic is self-extinguishing and cures fast at room temperature, permitting filled edges to be sanded within 3-4 hours.

DESCRIPTION: Epocast® 8623-A resin/Hardener 9861 epoxy syntactic is a two-part, core-filling compound with a soft paste consistency for easy extrusion through a 1/8-in. (3mm) nozzle. Epocast® 8623-A resin/Hardener 9861 epoxy syntactic is self-extinguishing and cures at room temperature, if desired. Elevated temperature cure or post cure will improve elevated temperature properties.

DESCRIPTION: Epocast® 89537-A/B epoxy syntactic is a two-part system with glass-fiber reinforcement that can be trowelled or extruded into honeycomb core structures for fastener and attachment potting, core splicing and edge reinforcing. The syntactic has a non-sag consistency that allows for vertical application up to 1/2-inch (1 .25cm) thick. Epocast® 89537-A/B epoxy syntactic is self-extinguishing and meets the requirements of BMS 5-28 Type 7, Class 2.

DESCRIPTION: Epocast 927-1 GB epoxy syntactic is a frozen, one-component, structural material for reinforcing honeycomb parts that maintains high compressive strength at high temperatures. When thawed, the epoxy syntactic can be extruded from cartridges as a thixotropic paste. Epocast® 927-1 GB is qualified to RMS 027, type XV.

Description: Epocast ® 938-A-2 epoxy structural syntactic is a frozen, one-component, flame-retardant compound designed for reinforcing honeycomb structures. Epocast® 938-A-2 epoxy syntactic features high compressive strength at temperatures to >350°F (177°C). When thawed, it can be extruded from cartridges as a thixotropic paste. Epocast® 938-A2 is qualified to BMS, 5-28, Type 12 (classes 1 and 2) and Type 13; SMS 116201, Type 2; RMS 027, Type X; and others.

Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200°F and is available in premeasured kits. USES - Ideal for bonding a variety of substrates such as metal, glass and plastic. - Potting and encapsulation - Excellent chemical resistance, mechanical strengths and electrical properties. - Meets General Electric (GE) Specification number M-2820-CR

E-Pos 101X75 is a low molecular weight solid epoxy resin based on bisphenol A and epichlorohydrin. It is supplied as 75% m/m solids in xylene. E-Pos 101X75 is a high quality resin showing a homogeneous molecular weight distribution. Product applications E-Pos 101X75 is used at room temperature in combination with amine- or amide-based curing agents in the formulation of high quality two-component solventborne coatings. Thanks to its excellent mechanical and chemical properties, E-Pos 101X75 is ideal for application on concrete, for example in sealer formulations, or for metal protection. E-Pos 101X75 enables the formulation of industrial paints exhibiting high corrosion and chemical resistance and provides excellent substrate adhesion.

Product description E-Pos 327H is a non diluted bisphenol A based epoxy resin with a relatively low viscosity. Applications E-Pos 327H is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. Systems based on E-Pos 327H exhibit superior mechanical and chemical resistance properties as well as an excellent heat resistance. The slightly lower viscosity of E-Pos 327H compared to standard bisphenol A-based resins allows the formulation of systems with higher pigment and/or filler loadings. E-Pos 327H can be used in a variety of applications in the field of civil engineering such as floorings or adhesives, in the formulation of solventfree or high-solids coatings, in composite applications, in electronic such as laminates en in thermal and electrical isolation applications.

E-Pos 328 is a medium viscosity epoxy resin, based on bisphenol A and epichlorohydrin. E-Pos 328 does not contain any diluent. E-Pos 328 exhibits superior mechanical and chemical resistance properties and an excellent resistance to heat. Product applications E-Pos 328 is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. E-Pos 328 can be used in civil engineering applications such as floorings, mortars or solventfree adhesives. It can also be used in composites and in electrical and electronic applications.

E-Pos 362 is a low viscosity epoxy resin, based on Bisphenol F and epichlorohydrin. This resin does not contain any diluent. E-Pos 362 exhibits superior mechanical and chemical resistance properties and excellent heat resistance. The low viscosity of E-Pos 362 ensures excellent pigment and substrate wetting characteristics. E-Pos 362 is usually used in mixture with other epoxy resins, either to diminish their viscosity or to provide crystallisation resistance. Pure E-Pos 362 tends to crystallise. Product applications E-Pos 362 resin is used alone or in a admixture at room temperature in combination with amine-based curing agents in the formulation of two-component systems. It is typically used in civil engineering applications such as solventfree floorings, mortars or adhesives. It can also be used in composite applications such as filament winding and in electrical and electronic applications.

E-Pos 433 is a non diluted epoxy resin which is based on a mixture of Bisphenol A-based epoxy resin and Bisphenol F-based epoxy resin. E-Pos 433 is crystallisation-resistant. Product applications E-Pos 433 is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. The low viscosity of E-Pos 433 combined to a good mechanical and chemical resistance allows its use in various applications such as solventfree coatings, civil engineering (mortars, adhesives), composites (filament winding) or electrical (insulation).

E-Pos 514 is a low viscosity epoxy resin based on Bisphenol A en epichlorohydrin, which is diluted with an aliphatic monoglycidyl ether reactive diluent. The low viscosity of E-Pos 514 ensures excellent pigment and substrate wetting. Product applications E-Pos 514 is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. The good balance of properties which can be obtained with E-Pos 514 and its low viscosity allow its use in various civil engineering applications such as self-leveling or trowellable floorings, mortars, castings, adhesives, in solventfree or high-solids coatings or in the preparation of laminates.

E-Pos 530 is a new low viscosity bisphenol A epoxy resin diluted with an epoxidised alkyl phenol of natural source. Product characteristics E-Pos 530 exhibits low volatility and excellent crystallisation resistance. The low viscosity of the resin allows high filler loading and ensures good wetting thereof and of the substrate. The reactive diluent contained in the resin also acts as a flexibiliser, improving the mechanical properties, e.g. the impact resistance of the resin. E-Pos 530 shows excellent water and chemical resistance, excellent dimensional stability as well as maintained electrical characteristics. Product applications E-Pos 530 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. The good balance of properties which can be obtained with E-Pos 530 allows its use in various civil engineering applications such as floorings, mortars, grouts, laminates, adhesives, but also for the production of electrical castings and of solvent-free coatings.

E-Pos 540 is a low viscosity epoxy resin comprising a Bisphenol A/Bisphenol F resin blend and diluted with an epoxidised alcohol-type monofunctional reactive diluent. Applications E-Pos 540 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 540 does not crystallise upon storage. The low viscosity of the resin allows the use of high concentrations of pigments and/or fillers and systems based on E-Pos 540 show excellent compatibility with a variety of components, which renders this resin ideal for use in civil engineering applications such as self-leveling floorings, trowellable floorings or mortars and in solventfree or high-solids coatings as well as in adhesives.

E-Pos 542 is a low viscosity epoxy resin which is based on bisphenol A and bisphenol F and which is diluted with an epoxidised alcohol reactive diluent. Product applications E-Pos 542 epoxy resin is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. E-Pos 542 resists to crystallization during storage. The low viscosity of the resin allows high pigment and/or filler loadings and systems based on E-Pos 542 show excellent compatibility with a variety of components. For these reasons, that resin is ideal for use in various civil engineering applications such as self-leveling and trowellable floorings, mortars as well as in the formulation of solventfree or high-solids coatings and also in adhesives.

E-Pos 558 is a low viscosity epoxy resin based on Bisphenol A and Bisphenol F and diluted with a difunctional reactive diluent. E-Pos 558 is crystallisation-resistant. Product applications E-Pos 558 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 558 enables the preparation of systems providing excellent chemical resistance. E-Pos 558 can be used in civil engineering applications such as sealers, self-leveling floorings, trowellable floorings or mortars, but also in the formulation of solventfree coatings exhibiting a good resistance to chemicals.

E-Pos 562 is a low viscosity bisphenol A-based epoxy resins which is diluted with a bifunctional reactive diluent. Product applications E-Pos 562 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 562 enables the formulation of systems exhibiting high chemical resistance. This resin can be used in civil engineering applications such as self-leveling floorings, trowellable floorings or mortars and in the formulation of solventfree paints resisting to chemical agents.

E-Pos 674X90 is a semi-solid modified bisphenol A-based epoxy resin in xylene solution (90% m/m resin in xylene). E-Pos 674X90 has been developed for use in high-solids applications and is characterized by a high degree of flexibility and a reduced solution viscosity. Product applications E-Pos 674X90 is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. This resin has specifically been developed for use in high-solids coatings for metal or concrete protection. E-Pos 674X90 enables the formulation of anticorrosive paints with a solids content of up to 85% m/m at application viscosity. Compared to solventborne resins, E-Pos 674X90 has a low solution viscosity, allowing for high pigment and/or filler loading, and exhibits excellent flexibility and impact resistance. This combination renders this resin ideal for use in metal primers as well as in protective top-coats.

E-Pos 941 is a cycloaliphatic epoxy resin for heat cure applications, which can be cured with carboxylic acid anhydrides, with or without catalyst, to produce systems for electrical applications, in particular for outdoor use. Product applications E-Pos 941 is used in solventfree systems for the preparation of electrical elements, in particular for outdoor applications with exposition to severe climate conditions. This heat curing product has also been developed for metal insulation, casting of electrical insulators, transformers insulation, etc. The resin shows an excellent arc resistance and outstanding mechanical, thermal and electrical properties. The system should be cured in an oven, under vacuum, at a temperature of typically 70°C to 100°C, but which can go up to 140°C-150°C.

EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPO-TEK® 301-1 is a two component, room temperature curing epoxy featuring very low viscosity and excellent optical and mechanical properties. It is a lower viscosity version of EPO-TEK® 301.