Polyaryletherketone (PAEK): PEEK
| 製品 | 可用性 | 製品の説明 |
|---|---|---|
| LNP™ LUBRICOMP™ Compound LL004C | アジア太平洋地域 |
LNP LUBRICOMP LL004C compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant, LNP Clean Compounding Technology.
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| LNP™ LUBRICOMP™ Compound LX00430 | アジア太平洋地域 |
LNP LUBRICOMP LX00430 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Wear Resistant.
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| LNP™ LUBRICOMP™ Compound LX19222 | アジア太平洋地域 |
LNP LUBRICOMP LX19222 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing, Excellent Wear Resistance and Low CTE.
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| LNP™ LUBRICOMP™ Compound LX91475 - Americas | ラテンアメリカ |
LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.
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| LNP™ LUBRICOMP™ Compound LX91475 - Asia | アジア太平洋地域 |
LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.
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| LNP™ LUBRICOMP™ Compound LX91475 - Europe | 欧州 |
LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.
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| LNP™ STAT-KON™ Compound LX00486C | アジア太平洋地域 |
LNP STAT-KON LX00486C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
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| LNP™ STAT-KON™ Compound LX00797C | アジア太平洋地域 |
LNP STAT-KON LX00797C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
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| LNP™ STAT-KON™ Compound LX04420C | アジア太平洋地域 |
LNP STAT-KON LX04420C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
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| LNP™ THERMOCOMP™ Compound LC003E - Americas | ラテンアメリカ |
LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive
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| LNP™ THERMOCOMP™ Compound LC003E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive
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| LNP™ THERMOCOMP™ Compound LC004XXP | アジア太平洋地域 |
LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006 - Americas | ラテンアメリカ |
LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006 - Europe | 欧州 |
LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC006EX1 | アジア太平洋地域 |
LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.
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| LNP™ THERMOCOMP™ Compound LC006EXQ | アジア太平洋地域 |
LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LC008E - Americas | ラテンアメリカ |
LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC008E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LC008EXP | アジア太平洋地域 |
LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LC008EXQ | アジア太平洋地域 |
LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LC00AEX1 | アジア太平洋地域 |
LNP THERMOCOMP LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.
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| LNP™ THERMOCOMP™ Compound LC00APXQ | アジア太平洋地域 |
LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LCF62E - Americas | ラテンアメリカ |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LCF62E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LCF62E - Europe | 欧州 |
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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| LNP™ THERMOCOMP™ Compound LF002 - Americas | ラテンアメリカ |
LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF002 - Europe | 欧州 |
LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF002EXD-WT02005 | アジア太平洋地域 |
LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF002XXP-WT02005 | アジア太平洋地域 |
LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.
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| LNP™ THERMOCOMP™ Compound LF003 | アジア太平洋地域 |
LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF004E - Americas | ラテンアメリカ |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF004E - Asia | アジア太平洋地域 |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF004E - Europe | 欧州 |
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF004EX1 | アジア太平洋地域 |
LNP THERMOCOMP LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage
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| LNP™ THERMOCOMP™ Compound LF006 - Americas | ラテンアメリカ |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
|
| LNP™ THERMOCOMP™ Compound LF006 - Asia | アジア太平洋地域 |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF006 - Europe | 欧州 |
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
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| LNP™ THERMOCOMP™ Compound LF006E - Americas | ラテンアメリカ |
LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF006E - Europe | 欧州 |
LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
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| LNP™ THERMOCOMP™ Compound LF006EX1 | アジア太平洋地域 |
LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding.
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