BPF type, containing propylene glycol monomethyl ether

Special multifunctional BPA type

Flexibility Civil engineering, adhesion, electrics

NBR modified, impact resistance, high peeling strength Structure Adhesives

NBR modified, low viscosity Structure Adhesives

NBR modified type, High adhesion

Chelate modified type, High adhesion

Toughness, peeling adhesiveness Structure Adhesives

Flexibility, high peeling strength Adhesives for automobile components

Toughness, adhesiveness Structure Adhesives

High performance epoxy structural adhesive 1.Introduction This product is tow-part thixotropic high performance and long operating time epoxy structural adhesive. 2.Applications Used for adhesion and bonding various materials,such as diamond, metal, stone, wood, ceramics and many kinds of plastics. The operating time is mediuim.

Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.

Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.

45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg system engineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).

47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heatsinks to multilayer epoxy PCBs. With a high Tg, the prepreg can be used in high-performance or hightemperature applications compared to a standard difunctional epoxy low-flow.

51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.

55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.

55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.

Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced Suggested uses: Encapsulation of electronics Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved chemical resistance. Low viscosity. Very good mechanical properties. Very high dimensional stability.

Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced Suggested uses: Lamp holder Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved electrical properties. Low post shrinkage.

Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced Suggested uses: Encapsulation of electronics Processes: Injection molding. Compression molding. Benefits: Heat resistant. High mechanical strength. Improved chemical resistance. Low viscosity. RTI: 155 °C. UL listed. Very high dimensional stability.

Type: Epoxy moulding compound, mica reinforced Suggested uses: Head lamp sockets Processes: Injection molding. Compression molding. Benefits: Heat resistant. Low viscosity.

Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced Suggested uses: Spark plug connectors. Terminal boards. Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved chemical resistance. Improved electrical properties.

BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins. Thanks to its medium viscosity, BB-EPA 1100 is very useful in a very wide range of applications, such as adhesive and coating.

BB-EPA 1250 is an epoxy resin based on Bisphenol A with molecular weight = 900 in emulsion. Thanks to its good wettability characteristic, BB-EPA 1250 is suitable for formulating system for metal and cement.

BC 6004 is a white thixotropic epoxy surface coat that has the ability to cure and bond to freshly poured wet plaster. This formulated resin compound can be applied with a brush or troweled to a thickness of 1/8” or less on vertical surfaces or over sharp radii without sag or fear of run-off. BC 6004 features moderate heat resistance and tracing hardness.

BC 6060 is a blue epoxy, abrasion resistant surfacing resin. Commonly referred to as “die surface” material, this system may be applied by brush or if preferred, cast in thin sections to a maximum of ½”. Ideally suited for a variety of applications, BC 6060 is recommended for dies, foundry pattern and core boxes, router, trim and inspection fixtures.

BC 5114 is a gray low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without post curing. For use above 150ºF a post-cure is required. BC 5114 can afford consistent use to 300ºF if required. Does not contain VCHD or MDA. Same uses as with BC 5105. See cure schedule.

BC-7009-1 is an iron filled, low-cost mass casting system. Thicknesses up to two inches in non-conductive molds, and four inches in conductive molds can be achieved without foaming or yielding excessive shrinkage. Ideal for stretch forms, patterns, dies, molds, duplications, prototypes, etc.

BC-7009-2 is an iron filled, low-cost mass casting system. Recommended for use in casting a minimum of two inches and a maximum of six inches in non-conductive molds. Thicknesses to nine inches in metal or conductive-type molds can successfully be achieved as well. Ideal for stretch forms, patterns, dies, molds, duplications, prototypes, etc.

BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yielding excessive shrinkage. Casting thicknesses may be increased by incorporating aluminum needles, puffs or granules. BC 7062, when properly cured, provides nearly perfect reproduction, resulting in a dimensionally stable, hard, tough surface. For use in constructing duplicate models, prototypes, patterns, facing dies, etc.

BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yielding excessive shrinkage. Casting thicknesses may be increased by incorporating aluminum needles, puffs or granules. BC 7062, when properly cured, provides nearly perfect reproduction, resulting in a dimensionally stable, hard, tough surface. For use in constructing duplicate models, prototypes, patterns, facing dies, etc.

BC-7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yielding excessive shrinkage. Casting thicknesses may be increased by incorporating aluminum needles, puffs or granules. BC-7062, when properly cured, provides nearly perfect reproduction, resulting in a dimensionally stable, hard, tough surface. For use in constructing duplicate models, prototypes, patterns, facing dies, etc.

BE-290 is a green low viscosity, medium pot life, room temperature laminating system. BE 290 features low odor, reduced toxicity and adequate working life for constructing medium and large fabricated tools.

PolyPoxy ® 5105 is a clear, unfilled, low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without post-curing. For use above 150ºF a post-cure may be required. PolyPoxy ® 5105 can afford consistent use to 300ºF if required. Does not contain VCHD or MDA. Useful for: - Constructing vacuum form tools - Injection and compression molds - RTM and RIM molds - Matched dies

PolyPoxy® 5003 Laminating Epoxy is a medium viscosity, unfilled laminating system. It is a room temperature curing resin with a relatively short pot life. BC 5003 is also considered an excellent general purpose adhesive for in-shop use. Recommended for use in gluing up BCC’s Tooling Board Series.

PolyPoxy® 5008-2 is a very low viscosity, modified, unfilled, room temperature curing, general purpose resin system. BC 5008-2 is a clear, amber, medium pot life material, with heat resistance to 175ºF. Also considered an excellent general purpose adhesive for in-shop use and will function as a laminating system for horizontal surfaces.

PolyPoxy® 5010 Laminating Epoxy is a high quality, low viscosity room temperature curing laminating resin. A Safety System for the production of a variety of dimensionally stable fiberglass tools. PolyPoxy® 5010 features low odor and rapid “wet-out” with no vertical drain off. An excellent general purpose laminating resin to meet the tooling requirements for automotive, aircraft and foundry.

BC 6005 is a snow white thixotropic epoxy resin designed specifically for quality reproduction of a variety of surfaces. A room temperature cure system that offers ample working time yet affords quick-tack for lamination. BC 6005 may be applied easily with a brush or troweled to a thickness of 1/8” or less on vertical surfaces or over sharp radii without sag or fear of run-off. When cured, this resin system provides a hard tough chip-resistant surface.