PolyPoxy® 6126 is a gray, low toxicity, aluminum filled, epoxy surface coat. This thixotropic resin system provides excellent surface duplication along with vertical coverage to 1/16 inch thickness. This heat resistant system may be used at room temperature without post-curing. For use above 150°F a post-cure is required. PolyPoxy® 6126 was engineered to replace VCHD and MDA systems while retaining excellent heat resistance. It is designed for consistent use up to 300°F. PolyPoxy® 6126 was developed for: - Constructing vacuum form tools - RTM and RIM molds - Compression and injection molds - Matched dies

PolyPoxy® 7136 is a gray, low toxicity, aluminum filled, epoxy casting resin. This heat resistant system may be used at room temperature without post-curing. May be cast to a thickness of ¾ inch in non-conductive molds. For use above 150ºF a post-cure is required. This product was engineered to replace VCHD and MDA systems while retaining excellent heat resistance and low viscosity. PolyPoxy® 7136 is designed for consistent use up to 300ºF. Useful for: - Heat resistant tooling - Constructing vacuum form tools - Injection and compression molds - RTM and RIM molds - Matched dies

PolyPoxy® 7136-2 is an aluminum filled thick section casting system with heat resistance to 300ºF. May be cast to a thickness of 2 inches in non-conductive molds, 3 inches in conductive molds and thicker sections with the addition of bulk fill. For service temperature above 150ºF a post-cure is required. Does not contain VCHD or MDA. See cure schedule.

This resin is a photo-curable resin that quickly and three-dimensionally cures by radical polymerization that occurs with electron beam (EB) or ultraviolet ray (UV) irradiation. This resin has been used widely for various applications. Type: - Rosin epoxy acrylate Characteristics: - Good adhesion Use: - Plywood - Ink - Adhesive

This resin is a photo-curable resin that quickly and three-dimensionally cures by radical polymerization that occurs with electron beam (EB) or ultraviolet ray (UV) irradiation. This resin has been used widely for various applications. Type: - Epoxy acrylate Characteristics: - Excellent hardness - Good workability Use: - Hard coatings - In mold film

This resin is a photo-curable resin that quickly and three-dimensionally cures by radical polymerization that occurs with electron beam (EB) or ultraviolet ray (UV) irradiation. This resin has been used widely for various applications. Type: - Epoxy acrylate Characteristics: - Excellent hardness - Low curl Use: - Hard coatings

This resin is a photo-curable resin that quickly and three-dimensionally cures by radical polymerization that occurs with electron beam (EB) or ultraviolet ray (UV) irradiation. This resin has been used widely for various applications. Type: - Epoxy acrylate Characteristics: - Dilute by water (~15%) - Quick curing Use: - Aqueous - OP varnish

TC-1570 A/B is a general-purpose white epoxy surface coat that can be used in conjunction with epoxy or polyurethane resin systems. TC-1570 A/B is noted for its ease of application and its ability to hang on vertical surfaces without sag or runoff.

TC-1600 A/B is an unfilled, low viscosity laminating epoxy resin for variety of fabricating applications. It features the ability to cure at room temperature for applications that do not require a working service temperature above 180°F (82?C). When post cured at elevated temperatures, this system can provide service up to 300°F (149°C). TC-1600 is commonly used to reinforce fiberglass, Kevlar/aramid, and carbon fiber fabrics. It is also used as an adhesive for bonding wood, composites, and other substrates. Adding fillers like fumed silica, micro-spheres, and short-strand fibers can create pastes for fillets, fairings, and bonding applications.

TC-1604 A/B is a filled, easy to apply, laminating epoxy resin for variety of fabricating applications.Designed to be used with heavier weight fiberglass cloth (typically 8-10 oz. tooling fabric), TC-1604 can produce thick laminates without excess draining of the resin. Being a very stable system with low shrinkage, its common usages include: - Drill and Trim Fixtures - Pattern/Foundry Applications - Composite Tooling - Support Shells for Silicone Glove Molds. It features the ability to cure at room temperature for applications that do not require a working service temperature above 224°F (107°C). TC-1604 can also be used as an adhesive for bonding wood, composites, and other materials. Adding fillers like fumed silica, micro-spheres, and short-strand fibers can create pastes for fillets, fairings, and bonding applications.

TC-1607 A/B is an unfilled, medium viscosity laminating resin for high temperature plastic tooling and part fabrication. This system is ideal for wet lay-up tooling applications where excellent dimensional stability and high mechanical properties are required. Features: - Easy to use for lay-ups requiring vacuum bagging - Withstands temperatures to 350°F (177°C) - Designed for fabrication nof a variety of molds

TC-1611 A/B is an easy to apply, heat resistant, black surface coat commonly used as a face coat for epoxy laminating and casting systems. TC-1611 A/B provides excellent surface detail reproduction and has a service temperature of 350°F (177°C). - Very easy to apply - No sag or runoff when applying up to 1/16" thickness - Heat resistance to 350°F (177°C) - Provides a hard durable surface

TC-1618 A/B is an aluminum filled hi-temp epoxy surface coat that provides a tough 90 Shore D surface. This resin compound can be applied with a brush, to a thickness of 1/16" on vertical surfaces or over sharp corners without sag or run-off. TC-1618 A/B features excellent heat resistance with ability to handle constant use at temperatures up to 300°F (149°C). This system does not contain "MDA" or "VCHD".

TC-1622 A/B is an unfilled laminating resin for high temperature mold and part fabrication formulated to provide superior wet-out and adhesion to a variety of substrates. It is a great material for Vacuum Assisted Resin Transfer Molding (VARTM) as well as other wet lay-up methods due to its low viscosity and long working time. When properly cured TC-1622 A/B can be used up to 350°F (177°C).

TC-1650 A/B is an aluminum powder filled epoxy casting resin system that provides service temperatures to 350°F (177°C). TC-1650 A/B is most commonly used for the construction of molds that require good heat conductivity, outstanding durability and provide production run capability. The majority of applications for TC-1650 A/B are used in conjunction with other materials in developing composite mold structures; however, the TC-1650 A/B is frequently used by itself. - Molds for casting polyurethane, epoxy, polyester, and other materials - Vacuum form molds - Wax casting molds - Compression molds

TC-1651 A/B is an aluminum powder filled epoxy casting resin system that provides service temperatures in the range of 340°F (171°C). TC-1651 A/B is most commonly used for the construction of molds that require good heat conductivity, outstanding durability, and that provide production run capability.

Bisphenol-A solid epoxy resin Applications: It is used widely to preparing various coatings, e.g powder coating, solvent coating, anti-corrosive paint, etc.

Bisphenol-A solid epoxy resin Applications: It is used widely to preparing various coatings, e.g powder coating, solvent coating, anti-corrosive paint, etc.

Bisphenol-A solid epoxy resin Applications: It is used widely to preparing various coatings, e.g powder coating, solvent coating, anti-corrosive paint, etc.

Bisphenol-A liquid epoxy resin Applications: This product is general epoxy resin. It has fine electricity insulating property, good cohesiveness and good property for process operation. It is used widely to prepare non-solvent or less-solvent coatings, glass fiber reinforced plastics, composite, adhesive, casting, etc.

Bisphenol-A liquid epoxy resin Applications: This product is general epoxy resin. It has fine electricity insulating property, good cohesiveness and good property for process operation. It is used widely to prepare non-solvent or less-solvent coatings, glass fiber reinforced plastics, composite, adhesive, casting, etc.

Bisphenol-A liquid epoxy resin Applications: This product is general epoxy resin. It has fine electricity insulating property, good cohesiveness and good property for process operation. It is used widely to prepare non-solvent or less-solvent coatings, glass fiber reinforced plastics, composite, adhesive, casting, etc.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.

Phenolic epoxy resin Applications: It is phenolic modified, with compact structure. Its heat resistance is better than that of E-type epoxy resin. It is used for the cohesion, sealing, laminating and pouring of various materials etc.

Phenolic epoxy resin Applications: It is phenolic modified, with compact structure. Its heat resistance is better than that of E-type epoxy resin. It is used for the cohesion, sealing, laminating and pouring of various materials etc.

Phenolic epoxy resin Applications: It is phenolic modified, with compact structure. Its heat resistance is better than that of E-type epoxy resin. It is used for the cohesion, sealing, laminating and pouring of various materials etc.

O-cresol epoxy resin Its heat resistance and electricity insulating property are good. It is mainly used as the plastic sealing material for electronic devices.

O-cresol epoxy resin Its heat resistance and electricity insulating property are good. It is mainly used as the plastic sealing material for electronic devices.

O-cresol epoxy resin Its heat resistance and electricity insulating property are good. It is mainly used as the plastic sealing material for electronic devices.

Bisphenol-A solid epoxy resin Applications: It is used widely to preparing various coatings, e.g powder coating, solvent coating, anti-corrosive paint, etc.

Bisphenol-A solid epoxy resin Applications: It is used widely to preparing various coatings, e.g powder coating, solvent coating, anti-corrosive paint, etc.

Bisphenol-A liquid epoxy resin Applications: This product is general epoxy resin. It has fine electricity insulating property, good cohesiveness and good property for process operation. It is used widely to prepare non-solvent or less-solvent coatings, glass fiber reinforced plastics, composite, adhesive, casting, etc.

Bisphenol-A liquid epoxy resin Applications: This product is general epoxy resin. It has fine electricity insulating property, good cohesiveness and good property for process operation. It is used widely to prepare non-solvent or less-solvent coatings, glass fiber reinforced plastics, composite, adhesive, casting, etc.