EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.

EPO-TEK® H73 is a two component, thermally conductive, electrically insulating epoxy. It is a higher viscosity alternative to EPO-TEK® H74.

EPO TEK® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

A two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, and optical applications. It is an IR transparent version of EPO-TEK H74 which enables fiber optic and photonic packaging. Due to its low viscosity, it is useful for sealing, potting and encapsulation projects.

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK® H74.

A two component, thermally conductive, epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general. It is a fluorescent version of EPO-TEK®H74 for inline inspection.

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.

EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

A two component, thermally conductive, electrically insulating epoxy designed for high temperature applications. It is a smaller particle size version of EPO-TEK® H77.

EPO-TEK® H77T is a two component, thermally conductive, electrically insulating epoxy designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

EPO-TEK® H81 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging.

A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

A single component epoxy for fiber optic and semiconductor applications. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process and save production time.

Single component epoxy for fiber optic and semiconductor applications. It is a higher viscosity version of EPO-TEK® HYB-297-RT. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process and save production time.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

A single component, high temperature epoxy for semiconductor, hybrid, fiber optic, and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher thixotropy version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher thixotropy version of EPO-TEK® HYB-353ND.

A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto opto-sensors.

A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into the opto-package. B-stage adhesive joining of glass or optics can also be realized.

EPO-TEK® MED-301 is a biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are: self-leveling, short pot-life, and ease of application, either by dispensing or manual operation. EPO-TEK® MED 301 is used often in molding headers in pacemakers, cochlear implants and neurostimulator implants, as well as bonding in many other types of medical devices. When longer pot-life, lower stress and large-scale manufacturing is needed, EPO-TEK® MED 301-2 can usually be interchanged.

EPO-TEK® MED-301-2 is a biocompatible, clear and colorless, low viscosity, long pot-life, room temperature curing epoxy. Additional characteristics are: ease of use in potting and casting, excellent adhesion to glass, quartz, wood and most plastics. As a compliant, low stress adhesive, it is used in bonding of optics and resistant to impact or vibrations. Used often in endoscopes and in various imaging systems.

EPO-TEK® MED-301-2FL is a biocompatible, low temperature curing, low stress and more flexible version of MED-301-2. It is used in fiber optic applications as well as potting, casting and laminating; with excellent adhesion to glass, quartz, metals and most plastics.

EPO-TEK® MED-302-3M Black is a biocompatible, black, opaque, medium viscosity epoxy. Additional characteristics are: high moisture and chemical resistance and is capable of low temperature curing. It has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-302-3M is a biocompatible, clear and colorless, low viscosity epoxy, with high moisture and chemical resistance and is room temperature curing. Additional characteristics are: can be used in the optical pathway with transmission in the VIS/NIR range from 350-1550nm, easily wicks into fiber bundles for endoscopes and light guides, and has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-302-3M-R is a biocompatible, clear and colorless, low viscosity epoxy designed to meet European Regulatory Requirements. It has high moisture and chemical resistance and is room temperature curing. Additional characteristics are: can be used in the optical pathway with transmission in the VIS/NIR range from 350-1550bnm easily wicks into fiber bundles for endoscopes and light guides, and has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-320 is a black, biocompatible, thixototropic, low temperature curing, optically opaque epoxy for fiber optics, camera and photonic packaging, often used in bonding/potting/sealing of optics used in various medical imaging electronics.

EPO-TEK® MED-323LP is a biocompatible, high strength, high temperature, high Tg, long pot-life epoxy. It is used in many medical applications for adhesive, potting, sealing and encapsulation, especially suited for use in fiber optics, endoscope, implants and surgical tooling.

EPO-TEK® MED-353ND Black is a biocompatible, black, high Tg, high strength, high temperature epoxy, based on our well known EPO-TEK® 353ND adhesive. It was formulated for use in many medical applications, especially fiber optic, endoscopes, and implants.

EPO-TEK® MED-353ND is a biocompatible, high temperature, high Tg, and high strength epoxy. It has decades of use and reliability in medical device designs worldwide. Medical applications span from fiber optics and endoscopes, to implants, to diagnostic equipment, to imaging modalities, to surgical tooling. It has high adhesion to SST, titanium, ceramics, glass and most plastic, as well as high chemical and moisture resistance.

EPO-TEK® MED-353ND-T is a biocompatible, thixotropic formulated version of EPO-TEK® MED-353ND. It has non-flowing properties (paste/non- sagging) and high temperature resistance. Some additional characteristics are: built-in color change in curing, and high strength. It is design in many medical devices where a high strength, non- flow adhesive is desired.

EPO-TEK® MED-354 is a biocompatible, high Tg, medium viscosity epoxy with a very long (3 day) pot life used in many medical applications, especially fiber optic endoscopy. It has excellent adhesion to quartz, Au, kovar, SST and most plastics and like EPO-TEK® MED-353ND has a color change upon cure, and excellent autoclave resistance..

EPO-TEK® MED-354-T is a biocompatible, high Tg, thixotropic version of EPO-TEK® MED-354 epoxy. It is electrically and thermally insulating and formulated for medical applications with fiber optics, optoelectronic assemblies, as well as semiconductor packaging.

EPO-TEK® MED-375 is a biocompatibile, high Tg, high temperature epoxy. It has a color change upon cure and can provide near hermetic sealing. Additionally, it has excellent adhesion to many surfaces including: SST, titanium, ceramic, glass and most plastics. In designs, often used in potting fibers and active alignment of optics, as well as laminating PZT ferroelectrics in ultrasound applications.

EPO-TEK® MED-377 is a biocompatible, high Tg, high temperature epoxy. Due to its low viscosity, it is easy to use and can be applied easily by many methods. It has excellent chemical and moisture resistance, and often used in potting fibers for endoscopes.

EPO-TEK® MED-730-110 is a biocompatible, high Tg, medium viscosity, room temperature-curring, thermally and electrically insulating epoxy. it is easy to use and can be applied easily by many methods. It can be used for sealing, potting, or encapsulation applications found in many medical devices.

EPO-TEK® MED-H20E is a biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use. It is versatile in curing techniques; from box oven, to IR, to hot plate, to convection ovens and is used for circuit connections. Some typical applications are: pacemaker hybrid circuits, Xrays, ultrasound, and hearing aids using MEM or hybrid technology.

EPO-TEK® MED-H20S is a biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a smooth low viscosity paste with fine Ag particles. It is a well characterized and highly reliability ECA, used most often for critical circuit connections and EMI coatings and has a curing time and temperature lower than EPO-TEK® MED-H20E.