Two component, thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation applications. Replacement for EPO-TEK® T905.

EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.

EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications

EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.

EPO-TEK® TD1001-67 is a soft single component, thermally conductive, electrically insulating epoxy. It is a more compliant version of EPO-TEK® TD1001.

Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.

Single component, thermally conductive, electrically insulating epoxy containing 2 mil glass beads for bond-line control in adhesive and sealing applications. It is the replacement for EPO-TEK® TH106-4.

Single component, thermally conductive for semiconductor and microelectric assembly. It is designed for superior wetting and adhesion strength to gold hybrid circuit substrates and packaging materials. It is a replacement for EPO-TEK® TH106.

EPO-TEK® TJ1104-LH is a black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.

A two component, low-halogen, electrically insulating die attach adhesive with long pot life.

EPO-TEK® TJ2139-LH is a two component, electrically insulating epoxy adhesive designed to meet low halogen standards.

A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.

Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.

EPO-TEK® TV2001 is a two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.

EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.

A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.

EPO-TEK® UD1214 is optically opaque epoxy, which can be cured by UV, UV plus thermal or heat only. It is especially designed for UV fast cure and following low temperature (<80C) curing for shadow areas. It can be used as adhesive, sealing, and encapsulation in semiconductor, electro-optics, fiber optics, circuit assembly, medical and scientific/OEM industries for blocking out light in opto-packages.

Optically clear UV curable adhesive and encapsulant designed to resist discoloration during solder reflow processing.

EPO-TEK® UD1824 is single componet, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

A single component, low viscosity UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectric packaging application.

EPO-TEK® UJ1190 is a clear, UV curable adhesive.

EpoxAcast™ 650 and EpoxAcast™ 650 BLACK are mineral filled general purpose casting epoxies that are low cost and versatile. They feature a low mixed viscosity for minimal bubble entrapment. Choose Fast, Medium or Slow catalyst to fit your project. You can also use HT Hardener to give your castings higher heat resistance. EpoxAcast™ 650 and EpoxAcast™ 650 BLACK are used for making hard dies for metal stamping as well as patterns and fixtures. They are also used for electrical encapsulation to extend the life cycles and enhance the performance of potted electronic devices. The high compressive strength of EpoxAcast™ 650 and EpoxAcast™ 650 BLACK makes it ideal for making stamping dies for production pressing of metal ornaments.

EpoxAcast™ 650 is a mineral filled general purpose casting epoxy that is low cost and versatile. It features a low mixed viscosity for minimal bubble entrapment. Choose Fast, Medium or Slow catalyst to fit your project. You can also use HT Hardener to give your castings higher heat resistance. EpoxAcast™ 650 is used for making hard dies for metal stamping as well as patterns and fixtures. It is also used for electrical encapsulation to extend the life cycles and enhance the performance of potted electronic devices. The high compressive strength of EpoxAcast™ 650 makes it ideal for making stamping dies for production pressing of metal ornaments.

EpoxAcast™ 655 (formerly Metalset™ A-30) is a versatile aluminum filled castable epoxy that is very hard and strong. It is dimensionally stable, even when mass cast up to 512 in3/ 8,390 cm3. Different hardener speed options are available depending on your project requirements. Maximum heat resistance is achieved using HT HIGH TEMP hardener (up to 225°F/108°C). Cured EpoxAcast™ 655 epoxy has high physical properties and is used for a variety of applications including making hard tooling, vacuum forming dies/molds, injection molds, foundry patterns, jigs and fixtures and metal forming dies. Depending on project requirements, Part A Base can be mixed with 101 FAST, 102 MEDIUM, 103 SLOW or HT HIGH TEMP hardeners.

EpoxAcast™ 670 HT (formerly 20-136) is an epoxy casting compound which offers high heat resistance up to 350° F/177° C if post cure schedule is used. EpoxAcast™ 670 HT features a relatively low viscosity that ensures minimal bubble entrapment. EpoxAcast™ 670 HT also offers an extra long working time of 3 hours. Castings cure with negligible shrinkage and are very hard, very strong and heat resistant. EpoxAcast™ 670 HT is ideal for making vacuum form molds, foundry patterns, forming dies & fixtures, hard rollers, industrial parts and high impact tools. EpoxAcast™ 670 HT is also suitable for encapsulation applications or for use as a high temperature epoxy for bonding a variety of surfaces.

EpoxAcast™ 690 and 692 Deep Pour are UV resistant clear casting epoxy resins suitable for a variety of industrial and art related projects requiring a rigid, clear finished casting. EpoxAcast™ 690 and 692 feature a very low viscosity for easy mixing and minimal bubble entrapment. Castings cure with negligible shrinkage and are very hard and strong. Resin can be colored with UVO™ or IGNITE™ colorants. Cast Magic™ and Glow Worm™ powders can also be added to create amazing casting effects. There are 2 ways to process these resins, using standard casting and fan-cooled casting techniques. Standard Casting - Using a standard casting method, EpoxAcast™ 690 has a maximum casting thickness of 3/8 in. (0.95 cm) while EpoxAcast™ 692 Deep Pour has a maximum casting thickness of 1 1/2” (3.81 cm). Material should be poured and cured at an ambient temperature of 70°F/21°C. Fan-Cooled Casting - To use a fan-cooled casting method, inexpensive box fans are placed near the curing epoxy to circulate air across the surface of the casting. This assists in cooling the material, allowing for thicker castings. Using a fancooled pouring method, EpoxAcast™ 690 has a maximum casting thickness of 3/4” (1.9 cm) while EpoxAcast™ 692 Deep Pour has a maximum casting thickness of 2” (5.08 cm). Material should be poured at an ambient temperature of 70°F/21°C.

EpoxAcast™ 690 and 692 Deep Pour are UV resistant clear casting epoxy resins suitable for a variety of industrial and art related projects requiring a rigid, clear finished casting. EpoxAcast™ 690 and 692 feature a very low viscosity for easy mixing and minimal bubble entrapment. Castings cure with negligible shrinkage and are very hard and strong. Resin can be colored with UVO™ or IGNITE™ colorants. Cast Magic™ and Glow Worm™ powders can also be added to create amazing casting effects. There are 2 ways to process these resins, using standard casting and fan-cooled casting techniques. Standard Casting - Using a standard casting method, EpoxAcast™ 690 has a maximum casting thickness of 3/8 in. (0.95 cm) while EpoxAcast™ 692 Deep Pour has a maximum casting thickness of 1 1/2” (3.81 cm). Material should be poured and cured at an ambient temperature of 70°F/21°C. Fan-Cooled Casting - To use a fan-cooled casting method, inexpensive box fans are placed near the curing epoxy to circulate air across the surface of the casting. This assists in cooling the material, allowing for thicker castings. Using a fancooled pouring method, EpoxAcast™ 690 has a maximum casting thickness of 3/4” (1.9 cm) while EpoxAcast™ 692 Deep Pour has a maximum casting thickness of 2” (5.08 cm). Material should be poured at an ambient temperature of 70°F/21°C.

EpoxAcoat™ HT is a slightly thixotropic epoxy gel coat that offers high heat resistance to 284°F / 140°C (post cure required). Cured epoxy is tough and offers exceptional abrasion resistance. This surface coat will wet out well over a variety of surfaces with good sag resistance. Applications include laminating, precision tooling, master and pattern making, core boxes and fixtures. Use as a surface coat for EpoxAmite™ HT high temperature laminating epoxy.

EpoxAcoat™ RED, GREY, WHITE and NEUTRAL are thixotropic epoxy gel coats which are widely used for hand laminating and tooling applications. They are tough and strong surface coat resins which cure at room temperature and offer exceptional abrasion resistance. EpoxAcoat™ NEUTRAL is formulated “color neutral” specifically for adding color pigments and fillers. For high temperature applications (to 284°F / 140°C) use EpoxAcoat HT™ (see separate technical bulletin). EpoxAcoat™ Surface Coat Epoxies are easy to use, wet out well over a variety of surfaces and will coat vertical surfaces without sagging. After the epoxy becomes “tacky-hard” at room temperature, fiberglass cloth is laminated behind the surface coat using Free Form™ AIR putty or EpoxAmite™ Laminating Epoxy to produce strong, lightweight tools that have excellent dimensional stability and surface finish. Cured surface machines precisely without chipping. Applications include precision tooling, master and pattern making, core boxes and fixtures.

EpoxAmite™ 100 Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite™ 100 Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical and performance properties. It can be sanded, shaped, machined, drilled, tapped and painted. EpoxAmite™ 100 Laminating System can be used with reinforcements such as S-Glass, E-Glass, Kevlar and Carbon fibers for lay-up applications or composite parts. EpoxAmite™ 100 Resin can also be mixed with fillers such as fumed silica for gel coat applications. Urefil™ 3, Urefil™ 7 and other fillers can be added for fairing, filleting or bonding applications.

EpoxAmite™ 100 Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite™ 100 Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical and performance properties. It can be sanded, shaped, machined, drilled, tapped and painted. EpoxAmite™ 100 Laminating System can be used with reinforcements such as S-Glass, E-Glass, Kevlar and Carbon fibers for lay-up applications or composite parts. EpoxAmite™ 100 Resin can also be mixed with fillers such as fumed silica for gel coat applications. Urefil™ 3, Urefil™ 7 and other fillers can be added for fairing, filleting or bonding applications.

EpoxAmite™ 100 Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite™ 100 Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical and performance properties. It can be sanded, shaped, machined, drilled, tapped and painted. EpoxAmite™ 100 Laminating System can be used with reinforcements such as S-Glass, E-Glass, Kevlar and Carbon fibers for lay-up applications or composite parts. EpoxAmite™ 100 Resin can also be mixed with fillers such as fumed silica for gel coat applications. Urefil™ 3, Urefil™ 7 and other fillers can be added for fairing, filleting or bonding applications.

EpoxAmite™ HT High Temperature Laminating Epoxy is a water clear, UV resistant laminating epoxy that resists high temperatures up to 300°F / 149°C when properly cured. Pot life is 1 hour and cure time is 24 hours at 73°F / 23°C (post cure required – see post cure schedule). Ultra-low viscosity ensures uniform wetting out and fast penetration of reinforcement materials during hand lay-up or vacuum infusion processes. Cured resin offers superior physical properties. EpoxAmite™ HT High Temp Laminating Epoxy can be used with S-Glass, E-Glass, Kevlar and carbon fibers for making composite tooling or parts. Applications include making high temperature pre-preg parts, bonding fixtures, vacuum form molds and prototype injection molds. Use as a backup laminating resin for EpoxAcoat™ HT high temperature surface coat epoxy.

EpoxAmite™ White Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite™ White Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical and performance properties. It can be sanded, shaped, machined, drilled, tapped and painted. EpoxAmite™ White Laminating System can be used with reinforcements such as S-Glass, E-Glass, Kevlar and Carbon fibers for lay-up applications or composite parts. EpoxAmite™ White Resin can also be mixed with fillers such as fumed silica for gel coat applications. Urefil™ 3, Urefil™ 7 and other fillers can be added for fairing, filleting or bonding applications.

EpoxAmite™ White Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite™ White Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical and performance properties. It can be sanded, shaped, machined, drilled, tapped and painted. EpoxAmite™ White Laminating System can be used with reinforcements such as S-Glass, E-Glass, Kevlar and Carbon fibers for lay-up applications or composite parts. EpoxAmite™ White Resin can also be mixed with fillers such as fumed silica for gel coat applications. Urefil™ 3, Urefil™ 7 and other fillers can be added for fairing, filleting or bonding applications.

Epoxy resin moulding composition filled with inorganic resin carriers Increased thermal conductivity, very good electrical insulation properties and dimensional stability at high temperatures, excellent crack resistance to temperature changes/shock, very low ion content, isotropic properties Low stress encapsulation of sensitive electronic components, especially PCBA's. Furthermore, windings (stator and rotor), magnets and primary insulation of yoke teeth in e-mobility, where improved heat dissipation is required This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound High thermal conductivity, good mechanical strength, very good electrical isolation properties and dimensional stability at high temperatures, excellent cracking resistance regarding thermal shock stress Encapsulation of very sensitive electronic components where improved heat dissipation is required, in particular rotors and stators. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre reinforced epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures Primary application(s): Connectors, Thermocouples, Sensors, Resistors, Potentiometers This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

Mineraly reinforced epoxy resin moulding composition User-friendly and easy to use, simple moulding and easy demoulding, short curing time, very good polishability with excellent surface quality, very low shrinkage and therefore gap-free embedding, free from bisphenols and halogenated acid anhydrides Application: Hot mount of metallic materials for metallography resulting in a better mount with outstanding edge retention This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even with thin wall thickness and high temperatures, very good sealing connection on metal and EPOXIDUR EP 3580 T part surfaces Fluidproof encapsulation of electromagnetic coils, coil bodys and rectifiers This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)