EPO-TEK® OG159-2 is a single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications include semiconductor, electro-optics, fiber optic, and scientific/OEM. It can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing, and encapsulating devices.

A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, all-purpose adhesive.

EPO-TEK® OG198-54 is a single component, low viscosity, electrically and thermally insulating UV cure, medical grade epoxy.

EPO-TEK® OG198-55 is a high viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is the more thixotropic version of EPO-TEK® OG198-54.

EPO-TEK® OG198-55-1 is a single component, high thixotropic cloudy UV cure epoxy which is electrically and thermally insulating. It is the thixotropic version of EPO-TEK® OG198-54.

EPO-TEK® OG198-55HV is a high viscosity version of EPO-TEK® OG198-55, the fastest version of epoxy UV cure system with excellent adhesion strength.

EPO-TEK® OG198-763 is a medium viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is an intermediate rheology between EPO-TEK® OG198-54 and OG198-55.

A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB level electro-optics. It can also be used for sealing and coating applications.

UV curable adhesive designed for glob top encapsulation

A UV fast curing, optically clear adhesive offering compliance and high strength.

A two component, high Tg, low viscosity, optically opaque epoxy designed for packaging of fiber optics and opto-electronics. It can be used as an adhesive, seal or encapsulant for many types of fibers, components, packages and optics found in the sensor or scientific/OEM industries, as well as medical or telecomm devices.

A single component, semi-flexible epoxy adhesive designed for low stress bonding of fiber optic component applications. It is a thixotropic adhesive which can be applied by dspensing or screen printing techniques. It has a very long pot-life, capable of fast curing techniques.

A two component, slightly electrically conductive epoxy suggested for EMI and Rf shielding of sensor devices including IR detectors. Low viscosity, black color, IR opaque, fast cure, and reasonable pot-life are few of its traits. It was designed for adhering filter windows to opto-hybrids or the cap of TO-cans.

Two component, general purpose, very fast setting epoxy adhesive.

Two component, slightly thixotropic alternative to EPO-TEK® 302-3M. It is an epoxy adhesive/encapsulant designed for resisting moisture and damp heat in glob top applications.

Two component, slightly thixotropic alternative to 302-3M. It is an epoxy adhesive/encapsulant designed for resisting moisture and damp heat in glob top applications.

Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND

A two component, rapid setting, room temperature cure epoxy. It may be used for many adhesive and sealing applications found in semiconductor, electronics, medical, fiber optics, and electro-optical devices. This fast gelling epoxy is ideal for curing in situ or in the field.

A two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration and scientific/OEM industries. It is a slightly higher viscosityand Tg alternative to EPO-TEK® 301.

EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors.

A two component, room temperature curing epoxy material.

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. It is a lower viscosity version of EPO-TEK® P1011-T.

Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging. It is a more viscous version of EPO-TEK® P1011.

A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, and optical applications. It is used mostly as a coating and dielectric layer. It can be used at high temperatures. It is a replacement for EPO-TEK® 390-1.

A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.

A lower viscosity version of EPO-TEK® T6065. It can be used for simiconductor die attach, SMD bonding, and general heat sinking for hybrid micro-electronic assembilies and packages.

A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

EPO-TEK® T6067-3 is a single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.

A single component, electrically insulating, low stress die attach epoxy designed for extended pot-life with fast curing techniques. It can be used for JEDEC level semiconductor packaging. Lead-frames loaded into magazines can be fast-cured inside traditional box ovens. Snap curing up 200°C-220°C may be realized. Replacement for EPO-TEK® T6116-R2.

A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect. Some features include low temperature curing, long pot-life and dielectric properties.

EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries.

EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14.

A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.

EPO-TEK® T7109-19 is a two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.

Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.

EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

Two component thermally conductive epoxy used for potting and encapsulating.

A two component, electrically insulating, low stress die attach epoxy designed for extended pot-life with fast curing techniques. It can be used for JEDEC level semiconductor packaging. Lead-frames loaded into magazines can be fast-cured inside traditional box ovens. Snap curing up 200°C-220°C may be realized. Replacement for EPO-TEK® T6116-R2.

EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

Thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation. Replacement for EPO-TEK® T905 Black.