EPO-TEK® MED-HYB-353ND is a biocompatible, high temperature specialty UV hybrid curing epoxy, formulated for process improvement (assembly) for photonic packaging. It has very high strength and moisture resistance.

EPO-TEK® MED-OD2002 is a biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant and when cured properly can withstand 1,000 autoclave cycles.

EPO-TEK® MED-OG116-31 is a biocompatible, one component, thixotropic, high Tg, cationic/epoxy UV curing adhesive. With thermal post curing, this UV has very high chemical resistance and is used in many types of implantable medical devices, specialized surgical and dental tools, as well as fiber optic lasers and catheters.

EPO-TEK® MED-OG198-55 is a single componet, electrically and thermally insulating, translucent cationic/epoxy UV with high viscosity, high Tg, and high strength. It is capable of curing in shadowed regions using an oven post-cure. It is used in many surgical and dental tools and specialized medical equipment, especially with active lens alignment and lasers.

EPO-TEK® MED-OG198-55 is a single componet, electrically and thermally insulating, translucent cationic/epoxy UV with high viscosity, high Tg, and high strength. It is capable of curing in shadowed regions using an oven post-cure. It is used in many surgical and dental tools and specialized medical equipment, especially with active lens alignment and lasers.

EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems (X-ray, Nuclear and MRI).

EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.

A white pigmented version of EPO-TEK® OD1001-67. It is a single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. It is also a more flowable version of EPO-TEK® TD1001-67.

EPO-TEK® OD121-42 (formerly R&D # 121-4-1) is a single component, low temperature cure epoxy with long pot life. It is designed for capillary underfill of heat sensitive electronic component packaging.

EPO-TEK® OD1361 (formerly R&D # 121-136-1) is an optically opaque epoxy. It is specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-136-4 fill formulations. It can be ussed for adhesive, sealing and encapsulation applications in semiconductor, electro-optics, fiber-optics, circuit assembly, medical and scientificOEM industries as well as for blocking out light in opto-packages.

EPO-TEK® OD1551 is an optically opaque epoxy. It is specially designed as the fill component for dam and fill applications in combination with EPO-TEK® OD1361 dam formulations. It can be used for adhesive, sealing and encapsulation applications in semiconductor, electro-optics, fiber optics, circuit assembly, medical and scientific/OEM industries as well as for blocking out light in opto-packages.

EPO-TEK® OD2002 is a two component, thermally and electrically insulating, optical epoxy. Designed as a high Tg yet still complilant alternative to EPO-TEK® 353ND.

A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.

A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.

A clear, flexible epoxy used for low stress adhesive and potting applications.

A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK® OE121.

A two component, optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23°C to 80°C, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation.

EPO-TEK® OE138 is a two component epoxy with intermediate viscosity range between EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.

A slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

A thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component slightly thixotropic epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

A slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. It is an enhanced adhesion version of EPO-TEK® OE145-4 with superior 85° C/85% RH resistance.

Thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. It also exhibits enhanced adhesion to metals and glass.

EPO-TEK® OE175-2 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is a modified alternative to EPO-TEK® 375 with improved wetting. Also available in a single component frozen syringe.

A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative to EPO-TEK® 353ND.

EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.

A two component, high Tg, low CTE epoxy, designed for adhesive and sealing applications within the semiconductor, hybrid sensor device and fiber optic industries.

A single component, optically transparent, UV curable adhesive for opto-electronic applications including fiber packaging, LCD, LEDs, sensor devices, SCI-OEM precision optics, and general electronic assembly. It is non-yellowing after cure as measured per ASTM D-1925.

EPO-TEK® OG116 is a single component, high index, high Tg, UV cure high viscosity adhesive. It was designed for optoelectronic applications including fiber optics packaging, sensor devices, SCI-OEM optics, and general electronic assembly.

EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.

A single component, UV curable, flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133.

EPO-TEK® OG133-8 is a single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.

EPO-TEK® OG142 is a single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. It is a clear and colorless, high Tg epoxy.

EPO-TEK® OG142-112 is a single component, low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.

EPO-TEK® OG142-112-LH is a low halogen version of OG142-112. single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectric packaging applications.

EPO-TEK® OG142-4 is a thixotropic version of EPO-TEK® OG142.

A single component, UV cured, thixotropic adhesive for semiconductor, PCB and opto-electric assembly. Due to its paste like rhelogy, it may be screen printed or dispensed, and is suggested for glob top DAM applications, or precision bonding of active optical components. It is an opaque epoxy intended for use outside the beam pathway.

EPO-TEK® OG142-87 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. It is a replacement version of EPO-TEK® OG142-13 with better bonding strength and moisture resistance.

EPO-TEK® OG142-95 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. It is a replacement version of EPO-TEK® OG142-17 with better bonding strength and moisture resistance.

A single component, semi-flexible epoxy adhesive designed for low stress bonding of fiber optic component applications. It is a thixotropic adhesive which can be applied by dispensing or screen printing techniques. It has a very long pot-life, capable of fast curing techniques.

EPO-TEK® OG154-1 is a single component, UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry. It is a replacement for EPO-TEK® OG154.