Huawei KL-G800H epoxy molding compound is suitable for thin leaded package without any flame retardant.. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.

Hysol® KL-2500-1K™ is a low thermal expansion and low stress molding compound suitable for GBU, KBU, TO, ZIP, SIP, DIP and SDIP packages, providing superior moldability and reliability. Applications - Semiconductor Molding Compounds - Through-Hole Discretes

KL-G800H CD epoxy molding compound is suitable for thin leaded package. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.

Hysol® KL-G900HP epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol® KL-G900HP offers enhanced reliability peformance for large QFN packages. KL-G900HP meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low wire sweep molding - Low warpage

UV8800M™ epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It offers a hard translucent coating when exposed to UV light of sufficient intensity. The curing of the product is not inhibited by oxygen, resulting in excellent surface cure. Its viscosity characteristics and dearated condition make it suitable for accurate dispensing with excellent shape control.

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad range of temperatures, from -55°C to 150°C. It can be used to bond metals, glass, wood and many plastics, including vinyl. The pot life is over one hour, which allows for easy positioning of parts.

INSULCAST 101 is an ambient temperature curing, two-component epoxy system with excellent chemical resistance to a broad range of environments such as acids, organic solvents and bases.

INSULCAST 116 FR is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio of the material makes it ideal for production line mixing as well as automatic dispensing. INSULCAST 116 FR is among the safest epoxy compounds available. It appreciably reduces the risk of eye, skin or respiratory problems generally associated with the use of epoxy compounds.

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. It appreciably reduces the risk of eye, skin or respiratory problems generally associated with the use of epoxy compounds.

INSULCAST 116 FR-FC-FS is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC-FS is among the safest epoxy compounds available. It appreciably reduces the risk of eye, skin or respiratory problems generally associated with the use of epoxy compounds.

INSULCAST 118 FC is an equal ratio by weight of volume epoxy potting/casting compound designed for dispensing equipment. INSULCAST 118 FC exhibits good impact strength and mechanical shock resistance.

INSULCAST 125 is a low viscosity, general purpose potting and casting compound. The low viscosity enables it to be used in potting densely packed modules, thereby insuring good flow and penetration around components. INSULCAST 125 contains non-abrasive fillers and is suitable for automatic dispensing equipment.

INSULCAST 125 is a low viscosity, general purpose potting and casting compound. The low viscosity enables it to be used in potting densely packed modules, thereby insuring good flow and penetration around components. INSULCAST 125 contains non-abrasive fillers and is suitable for automatic dispensing equipment.

INSULCAST 136 is an easy to use epoxy casting/potting compound exhibiting excellent adhesion to metals, ceramics and most plastics. When properly cured with INSULCURE 11B, INSULCAST 136 will conform to the requirements of MIL-I-16923, Types B, C & D, and will not support fungus growth.

INSULCAST 136 is an easy to use epoxy casting/potting compound exhibiting excellent adhesion to metals, ceramics and most plastics. When properly cured with INSULCURE 11B, INSULCAST 136 will conform to the requirements of MIL-I-16923, Types B, C & D, and will not support fungus growth.

INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties.

INSULCAST 3230 LV is a low viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion. Similar to INSULCAST 140 but lower viscosity. This system meets the NASA outgassing specifications with tolerances for TML ranging from 0.40 to 0.41% and for CVCM ranging from 0.0 to 0.1%.

INSULCAST 3230 LV is a low viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion. Similar to INSULCAST 140 but lower viscosity. This system meets the NASA outgassing specifications with tolerances for TML ranging from 0.40 to 0.41% and for CVCM ranging from 0.0 to 0.1%.

INSULCAST 333 is a moderate viscosity, self-extinguishing, epoxy potting/casting compound which conforms to the component program of Underwriters Laboratories' Flame Class 94V-O.

INSULCAST 333 is a moderate viscosity, self-extinguishing, epoxy potting/casting compound which is recognized under the component program of Underwriters Laboratories' Flame Class 94V-O.

INSULCAST 333 is a moderate viscosity, self-extinguishing, epoxy potting/casting compound which conforms to the component program of Underwriters Laboratories' Flame Class 94V-O.

INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. INSULCAST 42 bonds well to most metals and plastics.

INSULCAST 502 is an unfilled epoxy with low viscosity for general purpose casting and impregnation, exhibiting excellent electrical and physical properties.

INSULCAST 502 is an unfilled epoxy with low viscosity for general purpose casting and impregnation, exhibiting excellent electrical and physical properties.

INSULCAST 961 FR is a low density flame retardant epoxy casting system. INSULCAST 961 FR finds use in airborne or light weight equipment where thermal insulation or a low dielectric constant is required.

INSULCAST 985 FR is a semi-flexible flame retardant epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound. It has excellent electrical properties over a wide range of temperatures and conforms to the component program of Underwriters Laboratories' Flame Class 94V-O. INSULCAST 985 FR makes use of the latest polymer and filler technology.

INSULCAST 987 CM is a semi-flexible, potting compound that exhibits excellent electrical and physical properties over a wide range of temperatures.

INSULCAST LN 1-05 is a non-cracking epoxy compound that was specifically designed for large potting and encapsulation applications. It displays excellent electrical properties over a wide range of temperatures. INSULCAST LN 1-05 makes use of the latest polymer and filler technology.

INSULGEL 50 FC Black is a room temperature curing epoxy gel. It is low in viscosity and does not normally require vacuum de-gassing to assure bubble-free castings.

INSULGEL 70 CC FR NS is an epoxy compound which exhibits superior thermal shock resistance by making use of an inherently flexible epoxy resin and special filler technology. It provides reduced shrinkage and low coefficient of thermal expansion resulting in decreased stress and improved adhesion. In addition, a significant portion of the product is manufactured from environmentally sustainable raw materials. INSULGEL 70 CC FR NS is UL recognized under file E86165 & meets the flammability requirement of 94 V-0.

INSULGEL 90 is a room temperature curing, transparent, epoxy gel in which the gel number actually equals the hardness. INSULGEL 90 is low viscosity and does not normally require vacuum de-gassing to void-free castings and imbedments.

SBNA INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. SBNA Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Molding Compounds for Area Array Packages (BGA, CSP etc.) Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-2100A-S3

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-2150

We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Achieved Fast Cure for In-Line Process as well as Excellent Fillings and Applicable from Insertion Type to Surface Mount Type. Strong Points - Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages. - JEDEC level 1 is Possible in Ultra Small Packages. - Good Adhesion Strength Even after High Temperature Reflow Soldering Process. - Fast Cure Enabling High Productive In-Line Auto Process. - Excellent moldability and show improvement in moldability yield. Application - Surface Mount Device - TO-92 Type (Insertion Type) - Ultrasmall PKG

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module