We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Increase the freedom of designing and provides superior cost performance. Features - Least anisotropic structure, high dimensional accuracy molded parts - High mechanical modulus, lower deflection molded parts - Excellent electrical properties, especially good insulation properties, excellent heat resistant, excellent moldability, excellent storage behavior Application - Optical fiber connector components - Printer parts

Achieved Fast Cure for In-Line Process as well as Excellent Fillings and Applicable from Insertion Type to Surface Mount Type. Strong Points - Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages. - JEDEC level 1 is Possible in Ultra Small Packages. - Good Adhesion Strength Even after High Temperature Reflow Soldering Process. - Fast Cure Enabling High Productive In-Line Auto Process. - Excellent moldability and show improvement in moldability yield. Application - Surface Mount Device - TO-92 Type (Insertion Type) - Ultrasmall PKG

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2200

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2250 LKDS

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2270

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Applications: - for production of laminated segments reinforced with glass, carbon or kevlar fibers - using: parts of airplanes, sailplanes, sport boats, carriage bodies…. Special properties: - low molecular resin without filling material - with high impact resistance Type: low molecular epoxy laminated resin Application method: Mix Letoxit PR 217 with suitable curing agent according to the application method and required final properties of laminates. From production of 5M it is possible to use Letoxit EM 315, EM 316 or EM 317. If the mixture ratio is not stated, it is possible to determine the quantity of curing agent in grams for 100g of epoxy resin: x = He . Eekv x = quantity of curing agent in grams for 100 grams of epoxy resin resin: He = hydrogen equivalent weight of curing agent Eekv = epoxy equivalent epoxy resin in mol/100 g

Applications: - for production of laminated segments reinforced with glass, carbon or kevlar fibers - using: parts of airplanes, sailplanes, sport boats, carriage bodies…. Special properties: - extremely liquid low molecular resin without filling material Type: low molecular epoxy laminated resin Application method: Mix Letoxit PR 220 with suitable curing agent according to the application method and required final properties of laminates. From production of 5M it is possible to use Letoxit EM 315, EM 316 or EM 317. If the mixture ratio is not stated, it is possible to determine the quantity of curing agent in grams for 100g of epoxy resin: x = He . Eekv x = quantity of curing agent in grams for 100 grams of epoxy resin resin: He = hydrogen equivalent weight of curing agent Eekv = epoxy equivalent epoxy resin in mol/100 g

Applications: - for production of laminated segments reinforced with glass, carbon or kevlar fibers - using: parts of airplanes, sailplanes, sport boats, carriage bodies…. Special properties: - extremely liquid low molecular resin without filling material - with additives preventing from crystallization - with good mechanical properties, well physiologically tolerated Type: -extremely liquid low molecular epoxy laminated resin Application method: Mix Letoxit PR 227 with suitable curing agent according to the application method and required final properties of laminates. From production of 5M it is possible to use Letoxit EM 315, EM 316 or EM 317. If the mixture ratio is not stated, it is possible to determine the quantity of curing agent in grams for 100g of epoxy resin: x = He . Eekv x = quantity of curing agent in grams for 100 grams of epoxy resin resin: He = hydrogen equivalent weight of curing agent Eekv = epoxy equivalent epoxy resin in mol/100 g

LOCTITE® 3118™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include Memory cards, CCD/CMOS Assemblies.

Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.

LOCTITE® 3129™ is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.

LOCTITE 3329 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol® 3323™. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55°C to +125°C and humidity heat aging 85°C / 85% RH.

LOCTITE® A-304-29 is single component, pourable heat cure epoxy with excellent thermal stability and resistance to many chemicals. The product is especially useful for high strength bonding of assemblies that are exposed to severe chemical environments.

LOCTITE® A-316-30 is single component, thixotropic (non-sag rheology), heat cure epoxy with excellent thermal stability and resistance to many aggressive and harsh chemicals. The product is suitable for use as an end cap adhesive for filters exposed to many aggressive fluids. TYPICAL APPLICATIONS - Bonding and Sealing Components Exposed to Harsh Chemical environments - Filter End-Cap Adhesive / Sealer - Battery Component Bonding - Compressor Component Bonding

LOCTITE® EA 193124 / EA 193125™ is a low viscosity adhesive that can be gelled to a tack free, non-flow state with a few seconds of exposure to moderate UV light and then fully cured at room temperature or rapidly at elevated temperatures. The fully cured system develops strong, tough, high performance bonds to metals, ceramics, phenolics, polyesters, epoxies, urethanes and many other plastics. LOCTITE® EA 193124 / EA 193125™ is a durable, electrically insulating adhesive that provides good resistance to gases, vapors, petroleum solvents, fuels, salt solutions, mild acids and alkalis.

LOCTITE® EA E-30CL™ is a low viscosity, industrial grade epoxy adhesive. Once mixed, the two component epoxy cures at room temperature with minimal shrinkage to form an ultra clear adhesive bondline with excellent impact resistance. The fully cured epoxy is resistant to a wide range of chemicals and solvents and has excellent dimensional stability over a wide temperature range. Typical applications include bonding, small potting, staking and laminating applications where optical clarity and excellent structural, mechanical and electrical insulating properties are required. LOCTITE® EA E-30CL™ bonds most materials including glass, optical fibers, ceramics, metals, and many rigid plastics.

Loctite® EA E-40EXP™ is a two component, self-leveling epoxy designed for potting electric motors. Once mixed, the two component epoxy cures at room temperature. It can be potted into horizontal volumes and will flow to fill the voids. Typical applications include the potting of wire conduits to isolate the electrical motor from the surrounding environment.

LOCTITE® EA E-60NC is a flowable, industrial grade epoxy potting compound with extended work life. Once mixed, the two-part epoxy cures at room temperature to form a rigid, black encapsulant that is non-corrosive to metallic components on PC Boards and electronic assemblies. The fully cured epoxy provides excellent environmental and chemical resistance, and acts as an electrical insulator. TYPICAL APPLICATIONS Designed for bonding, potting and encapsulating electrical components which are sensitive to corrosion. Used in electronic applications, for component attachment to boards, housing assembly and potting.

LOCTITE EO7029 encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow during cure.

LOCTITE HYSOL GR 15F-1P is an anhydride cured molding compound containing spherical filler designed for those applications requiring high voltage, high power and/or high temperature performance.

LOCTITE HYSOL GR 2220 epoxy molding compound delivers outstanding performance and ease of use. Product Benefits - Green product - Environmentally friendly - High moldability - Fast cycle time

LOCTITE HYSOL GR 2310 epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL GR 2320 epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL GR 2710 epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL GR 2710 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High flexural strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2720 is a green epoxy based molding compound designed for the encapsulation of passive components. This material is an excellent candidate for the molding of pressure sensitive components. LOCTITE HYSOL GR 2720 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2725 is a green epoxy based molding compound designed for the encapsulation of passive components. This material is an excellent candidate for the molding of pressure sensitive components. LOCTITE HYSOL GR 2725 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2811 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.