This material is an epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications.

This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all spherical filler system ensures outstanding moldability especially with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.

This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.

This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provides a lower viscosity with higher flow characteristics than SMT-B-1. It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays.

This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.

This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.

This material is an epoxy molding compound optimized specifically for PBGA applications. It is a fast cure molding compound for automold applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications.

This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 260°C IR reflow temperatures.

This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures.

This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures.

This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 220°C IR reflow temperatures.

Plasti-Paste™ EPOXY is an epoxy-based version of Smooth-On’s popular urethane Plasti-Paste™ products. It is a two component, fiber-filled epoxy designed for vertical surface application. Part A is a paste and Part B is a liquid. Mix ratio is 2A: 1B by volume or weight. Pot life is 40 minutes and cure time is 16 hours at room temperature depending on mass. Applying heat can reduce cure time. Mixed material holds a vertical surface without sagging and cures very rigid and strong. Plasti-Paste™ EPOXY offers some advantages over urethane Plasti-Paste™ products: 1. Material is not affected by moisture. 2. Material has a longer working time for applying over large areas. 3. Cured material is more rigid with less being required for making support shells/mother molds and 4. Higher heat resistance up (160°F / 71°C). Liquid material can be colored with UVO™ colorants and cured epoxy can be sanded, machined and painted with acrylic enamel paints. This plastic can used as a support shell or mother mold material to reinforce rubber molds during casting. It can also be used for creating themed environments, creating art or special effects. This epoxy is also a powerful adhesive and can be used as a repair material for a variety of industrial applications.

Carbon fiber reinforced epoxy molding compound Features: - Fatigue Resistance - High Strength - High Stiffness - Black Color - Shelf Life 6 months @ 10°F or below

Lytex 64690 BK is a chopped carbon fiber reinforced molding compound. It is easily moldable and provides parts that are high strength, fatigue resistant, with zero VOC and a low density. The carbon fiber is standard modulus PAN based 12K tow. Features: - Excellent Mechanical Properties - Very good surface profile

E-glass reinforced epoxy molding compound .Features: - Fatigue Resistance - High Strength - High Stiffness - Shelf Life 6 months @ 10°F or below - Black or Natural Color

Mica reinforced moulding compound Low mould shrinkage and post-shrinkage, very good electrical values, outstanding heat resistance, very good pourability. Primary application(s): Car lamp base H-4/H-7 This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

An all purpose non-halogenated NEMA G10 glass epoxy sheet for electrical/electronic applications requiring moisture resistance and high mechanical strength. Not intended for arc and flame resistance. Meets MIL-I-24768/2

An all purpose flame retardant NEMA FR4 glass epoxy sheet with exceptional electrical and mechanical properties

NEMA G11 glass epoxy with mechanical and operating temperatures superior to FR4 and a U.L. flammability rating of 94 HB

Halogen-Free FR Epoxy (Phosphorus-modified Epoxy) Features: Cresol Novolac Base

Halogen-Free FR Epoxy (Phosphorus-modified Epoxy) Features: Cresol Novolac Base

Novolac Epoxy Solvent: Solid Features: High Tg, TPM Novoalc Epoxy

Novolac Epoxy Solvent: MEK Features: High Tg, TPM Novoalc Epoxy

High Mw Epoxy Solvent: MEK

High Mw Epoxy Solvent: MEK

High Mw Epoxy Solvent: PnB

High Mw Epoxy Solvent: MEK

Naphthalene Epoxy Biphenyl Naphthalene Epoxy

High Mw Epoxy Solvent: X-L, C-A

High Purity Epoxy Features: High Purity

High Purity Epoxy Features: High Purity

High Purity Epoxy Features: Low T-Cl Content, Low-Crylstalline

High Purity Epoxy Features: High Purity, Crylstalline

High Mw Epoxy Solvent: B-C, X-L

High RI Epoxy High Tg

High Purity Epoxy Features: High Purity, High Tg

High Purity Epoxy Features: High Purity, High Tg

High Purity Epoxy Features: High Purity, High Tg

High Purity Epoxy Features: N.V. 80wt%, Solvent: MEK

Crystalline Epoxy