LOCTITE HYSOL GR 640HV-L1 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL GR 725LV is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.

LOCTITE HYSOL GR 9810-1P is a state of the art epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It significantly increased beyond that of standard green compound chemistry.

LOCTITE HYSOL KL 1000-3LX provides the lowest cost of ownership with superior moldability and reliability. This material is designed to achieve JEDEC Level 4 requirements, at 220°C reflow temperature.

LOCTITE HYSOL KL 4500-1NT epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL 5000-HT epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL KL 6500S epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL 7000HA epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL G150 epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL G150 provides the lowest cost of ownership with superior moldability and reliability. Product Benefits - Green product - High moldability - High reliability - Low cost of ownership

LOCTITE HYSOL KL G450H epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature for a QFP package. LOCTITE HYSOL KL G450H meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High reliability

LOCTITE HYSOL KL G450S epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. LOCTITE HYSOL KL G450S epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL KL G450S meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High reliability

LOCTITE HYSOL KL G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol® LOCTITE HYSOL KL G730 offers enhanced reliability peformance for T/LQFP packages. LOCTITE HYSOL KL G730 meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - High adhesion - Low stress - Green product - Low viscosity - Low wire sweep molding - Large operating window

LOCTITE HYSOL KL-G 100 epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 100 provides the lowest cost of ownership with superior moldability and reliability.

LOCTITE HYSOL KL-G 200 epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL KL-G 200 provides the lowest cost of ownership with superior moldability and reliability.

LOCTITE HYSOL KL-G 200S epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 200S provides the lowest cost of ownership with superior moldability and reliability. LOCTITE HYSOL KL-G 200S meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - High moldability

LOCTITE HYSOL KL-G 500HT epoxy molding compound delivers outstanding performance and ease of use.

Hysol® LOCTITE HYSOL KL-G 900HC epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 900HC meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low wire sweep molding - Low warpage

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, general purpose potting compound resin that is designed to be mixed with LOCTITE® PE 3160 epoxy hardener. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and bond strength to most thermoplastics.

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3162 Hardener. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3165 Hardener. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures (200°F for 2-4 hours).

LOCTITE® PE 3141 Epoxy Resin is a resin formulated to offer improved long term performance at higher temperatures when mixed with LOCTITE® PE 3160 Epoxy Hardener. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and bond strength to most thermoplastics.

LOCTITE® PE 3141 Epoxy Resin is a resin formulated to offer improved long term performance at higher temperatures when mixed with LOCTITE® PE 3165 Epoxy Hardener. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures.

LOCTITE® PE 3142 forms a potting compound with high thermal conductivity when mixed with LOCTITE® PE 3160. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and good bond strength to most thermoplastics.

LOCTITE® PE 3142 Epoxy Resin forms a potting compound with high thermal conductivity when mixed with LOCTITE® PE 3162. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.

LOCTITE® PE 3142 Epoxy Resin forms a potting compound resin with high thermal conductivity when mixed with LOCTITE® PE 3165. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that is formulated to offer improved flame retardance when mixed with LOCTITE® PE 3162 Epoxy Hardener. This mixture is a low viscosity, room temperature cure product which features fast gelling during cure.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that offers improved flame retardance when mixed with LOCTITE® PE 3163. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and good bond strength to most thermoplastics.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that offers improved flame retardance when mixed with LOCTITE® PE 3164. This mixture forms a resilient, low viscosity, fast gelling, room temperature cure, with easy mix 2:1 ratio.

LOCTITE STYCAST 2651MM CAT 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining. LOCTITE STYCAST 2651MM CAT 23LV can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - General purpose - Low viscosity - Low color - Good machinability - Excellent adhesion to glass - Thermal shock and impact resistant - Reduced abrasion in meter/mix equipment

LOCTITE STYCAST EO 7038 is a one component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.