NEONIT® K82 L8 is a long glass fiber reinforced high temp. epoxy molding compound for applications demanding heat resist., high mech. properties & long term dim. stability at high temp. (as jet engines or indus. equipment), recommended for parts with metal inserts.

NEONIT® SK60 L8F is a medium flow long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding.

NEONIT® SK60 L8G is a high flow long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding.

NEONIT® SK80 L5G is a long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding and manufacturing of large commutators.

NEONIT® SK80 L8G is a long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding and manufacturing of large commutators.

EPOXY GLASS CLOTH LAMINATED SHEET TYPE EPGC308 EPGC308 provides high mechanical strength at elevated temperatures,stable electrical properties in high humidity, similar to EPGC203 but with improved heat resistance.

EPOXY GLASS CLOTH LAMINATED SHEET TYPE F882A (G-11) F882A has excellent electrical and mechanical properties,especially in performance against impact of voltage, maintain high mechanical strength at elevated temperatures. F882A can be used as slot wedge and insulation structural part in class F motors,,traction motors and electric transmission and transformation equipments.

EPOXY GLASS CLOTH LAMINATED SHEET TYPE F889 F889 magnetic product include iron powder. It has high mechanical strength, thermal endurance as well as good magnetic conductivity.

EPOXY GLASS CLOTH LAMINATED SHEET TYPE F890.1 (F890H) F890H is recommended if good electrical properties are required, CTI 600, halogen-free, flame resistant, good mechanical properties at 180°C. F890H is machined as insulation structural parts in class H motor, transformer, brush holder, railway industry, etc.

OPTODYNE is a reliable UV curable optical adhesive with controlled refractive index. - Ttransparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin. - It is used for connection of optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function. - Highly reliable adhesive with excellent adhesion and workability.

OPTODYNE is a reliable UV curable optical adhesive with controlled refractive index. - Ttransparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin. - It is used for connection of optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function. - Highly reliable adhesive with excellent adhesion and workability.

OPTODYNE is a reliable UV curable optical adhesive with controlled refractive index. - Transparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin. - It is used for connection of optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function. - Highly reliable adhesive with excellent adhesion and workability.

OPTODYNE is a reliable UV curable optical adhesive with controlled refractive index. - Transparent ultraviolet (UV) curing type optical adhesive based on fluorinated epoxy and fluorinated acrylate resin. - It is used for connection of optical fibers requiring optically optimal refractive index matching as well as adhesion fixing function. - Highly reliable adhesive with excellent adhesion and workability.

This material is a reduced-stress epoxy molding compound for the enapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs and SOICs. It was especially developed for balanced end use properties.

This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.

This material is a reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs and SOICs. It was especially developed for balanced end use properties.

This material is a high thermal conductivity epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs and power devices. It was especially developed for balanced end use properties.

This material is a standard epoxy molding compound used for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, to Transistors and SOICs. It was especially developed for balanced end use properties.

This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP's. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes.

This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP's. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes.

This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications. AMC-2RA is suitable for use with Ni/Pd preplated leadframes.

This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications.

This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.

This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs.

This material is an epoxy molding compound for high temperature, lead-free reflow in low alpha applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.

This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

This material is an epoxy molding compound for high temperature, lead-free reflow in heat spreader applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

This material is an epoxy molding compound for high temperature, lead-free reflow in low alpha applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor manufacturing productivity and reduces production costs.

This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties.

This material is a low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. It offers end users superior value-in-use due to a balanced mix of properties.

This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays.