Prospector

Epoxid (Epoxid): Epoxid

Produkt Verfügbarkeit Produktbeschreibung
Ablebond 7501F Nordamerika  
Ablebond 77-1S Nordamerika  
Ablebond 77-2LTC Nordamerika  
Ablebond 789-3 Nordamerika
ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.
Ablebond 8350M Nordamerika  
Ablebond 84-1LMI Nordamerika
ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe. ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.
Ablebond 84-1LMINB1 Nordamerika
ABLEBOND® 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. ABLEBOND® 84-1LMINB1 meets the requirements of MIL-STD-883, Method 5011.
Ablebond 84-1LMISR4 Nordamerika
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
Ablebond 84-1LMIT1 Nordamerika
ABLEBOND® 84-1LMIT1 adhesive is designed for die attach applications. It is designed for screen printing using 325 mesh. ABLEBOND® 84-1LMIT1 meets the requirements of MIL-STD-883C, Method 5011.
Ablebond 84-3 Nordamerika
ABLEBOND® 84-3 adhesive is designed for die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.
Ablebond 85-1 Nordamerika
ABLEBOND® 85-1® adhesive is designed for hybrid applications where silver migration is a critical concern. ABLEBOND® 85-1® meets the requirements of MIL-STD-883, Method 5011.
Ablebond 933-1 Nordamerika  
Ablebond 958-11 Nordamerika
ABLEBOND® 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. ABLEBOND® 958-11 meets the requirements of MIL-STD-883, Method 5011.
Ablebond 958-7 Nordamerika  
Ablebond 965-1L Nordamerika
ABLEBOND® 965-1L electrically conductive, stress-absorbing die attach adhesive is designed for bonding large die integrated circuits to substrates with mismatched coefficients of thermal expansion. ABLEBOND 965-1L adhesive exhibits very low levels of contaminants. The rheology of this adhesive is tailored for high speed,automated assembly operations. This product cures to yield a void-free bondline with minimal resin bleed.
Ablebond 967-1 Nordamerika
ABLEBOND® 967-1™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe.
Ablebond 967-3 Nordamerika
ABLEBOND® 967-3™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe. This material is a electrically insulating version of ABLEBOND 967-1 adhesive.
Ablebond 968-2 Nordamerika  
Ablefilm 550 Nordamerika
ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note: Using ABLEFILM® 550™ adhesive in hermetically sealed packages is not recommended.
Ablefilm 550K Nordamerika
ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.
Ablefilm 561 Nordamerika
ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired. After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive film is also available in a low temperature cure version.
Ablefilm 561K Nordamerika
ABLEFILM® 561K is designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.
Ablefilm 570 Nordamerika  
Ablefilm 570K Nordamerika  
Ablefilm ECF550 Nordamerika
Ablefilm® ECF550 silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, ECF550 adhesive film acts as an electrical ground plane. In the assembly or sealing of microelectronic packages which require RF shielding, ECF550 adhesive film maintains electrical continuity between joints. Ablefilm ECF550 adhesive film provides strong adhesion to gold and other difficult-to-bond metals. After exposure to moisture, it retains its bond strength. This adhesive film is also available in a low temperature cure version.
Ablefilm ECF550S Nordamerika
Ablefilm® ECF550S silver filled epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This adhesive film is supported by a 3.5-mil silver screen carrier. ECF550S adhesive film provides thermal conductivity values of 1.4 to 3.8 W/m°K, depending upon bondline pressure and initial film thickness.
Ablefilm ECF550X Nordamerika
ABLEFILM® ECF550X silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y, and z axes. When used for substrate attach, ECF550X acts as an electrical ground plane. It provides RF/EMI shielding.
Ablefilm ECF561 Nordamerika  
Ablefilm ECF561E Nordamerika
ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane.
Ablefilm ECF563 Nordamerika  
Ablefilm ECF564AHF Nordamerika  
Ablefilm ECF571 Nordamerika  
Acculam™ Epoxyglas G10 nonFR 4 Nordamerika
Acculam® Epoxyglas G10 nonFR - Laminate sheet comprised of a halogen free epoxy resin binder and a woven fiberglass substrate. It qualifies to NEMA G10 and MIL-I-24768/2. This material exhibits high mechanical strength and electrical insulating qualities under both dry and humid conditions. Its ease of fabrication allows its use in many structural and cryogenic applications where halogenated compounds may be undesirable.
Acculam™ Epoxyglas G10/FR4 Nordamerika
Acculam® Epoxyglas G10/ FR4, is a laminate sheet comprised of a flame retardant epoxy resin and a woven fiberglass substrate. This grade qualifies to NEMA FR4 and MIL-I-24768/27. This material has high mechanical strength and excellent electrical insulating qualities in both dry and humid conditions. These attributes along with good fabricating characteristics allow this grade to be used in a wide variety of electrical and mechanical applications.
Acculam™ Epoxyglas G11 nonFR 5 Nordamerika
Acculam® Epoxyglas G11 nonFR -Laminate sheet comprised of heat resistant/halogen free epoxy resin and a woven fiberglass substrate. It qualifies to NEMA G11 and MIL-I-24768/3 This material exhibits extremely high mechanical strength at elevated temperatures and has good dielectric loss and electric strength properties under both dry and humid conditions. It is resistant to flow, dimensional change, chemicals and has low moisture absorption.
Acculam™ Epoxyglas G11/FR5 Nordamerika
Acculam® Epoxyglas G11/ FR5 -Laminate sheet comprised of flame retardant/heat resistant epoxy resin and a woven fiberglass substrate. It qualifies to NEMA FR5 and MIL-I-24678/28. G11/FR5 material exhibits extremely high mechanical strength at elevated temperatures. It shows good dielectric loss and electric strength properties under both dry and humid conditions. It has good chemical resistance and low moisture absorption.
ADEKA ED-502 Afrika und Mittlerer Osten  
ADEKA ED-503 Afrika und Mittlerer Osten  
ADEKA ED-503G Afrika und Mittlerer Osten  
ADEKA ED-505 Afrika und Mittlerer Osten